Inventor · disambiguated record
Fang Liu
Also filed as: LIU FANG · LIU FANG-CHUANG
2 granted patents·48 citations·filing 2002–2019
56Inventor score
Top patents by PatentIndex Score
2 records- 0182US6541366B1Method for improving a solder bump adhesion bond to a UBM contact layerTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Apr 1, 2003·48 cites·20 claims
- 0246US11253919B2Toughened TiAl-based alloy sheet with periodically misaligned through-hole titanium alloy layers and preparation method thereofUNIV SHAANXI TECHNOLOGY·Filed 2019·Granted Feb 22, 2022·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →