Inventor · disambiguated record
Fabrizio Marchegiani
Also filed as: MARCHEGIANI FABRIZIO
8 granted patents·3 pending applications·13 citations·filing 2016–2024
78Inventor score
Files withAIR LIQUIDE AMERICAN8AIR LIQUIDE2LAIR LIQUIDE SA POUR LETUDE ET L’EXPLOITATION DES PROCEDES GEORGES CLAUDE1
Top patents by PatentIndex Score
11 records- 0193US11430663B2Iodine-containing compounds for etching semiconductor structuresAIR LIQUIDE AMERICAN·Filed 2020·Granted Aug 30, 2022·3 cites·18 claims
- 0288US10410878B2Hydrofluorocarbons containing —NH2 functional group for 3D NAND and DRAM applicationsAIR LIQUIDE AMERICAN·Filed 2017·Granted Sep 10, 2019·6 cites·20 claims
- 0386US10607850B2Iodine-containing compounds for etching semiconductor structuresAIR LIQUIDE AMERICAN·Filed 2016·Granted Mar 31, 2020·4 cites·19 claims
- 0484US2025092518A1Deposition of iodine-containing carbon filmsAIR LIQUIDE AMERICAN·Filed 2024·Application pending·0 cites
- 0578US12188123B2Deposition of iodine-containing carbon filmsAIR LIQUIDE AMERICAN·Filed 2021·Granted Jan 7, 2025·0 cites·8 claims
- 0661US12187853B2Silicon-based self-assembling monolayer compositions and surface preparation using the sameAIR LIQUIDE AMERICAN·Filed 2021·Granted Jan 7, 2025·0 cites·12 claims
- 0759US11499014B2Cureable formulations for forming low-k dielectric silicon-containing films using polycarbosilazaneAIR LIQUIDE·Filed 2019·Granted Nov 15, 2022·0 cites·20 claims
- 0855US12272562B2Oxygen and iodine-containing hydrofluorocarbon compound for etching semiconductor structuresAIR LIQUIDE AMERICAN·Filed 2021·Granted Apr 8, 2025·0 cites·20 claims
- 0954US2023095074A1CURABLE FORMULATIONS FOR FORMING LOW-k DIELECTRIC SILICON-CONTAINING FILMS USING POLYCARBOSILAZANEAIR LIQUIDE·Filed 2022·Application pending·0 cites
- 1053US2025161976A1New low-k materials derived by hydrosilylation and methods of using them for depositionLAIR LIQUIDE SA POUR LETUDE ET L’EXPLOITATION DES PROCEDES GEORGES CLAUDE·Filed 2023·Application pending·0 cites
- 1144US11798811B2Iodine-containing fluorocarbon and hydrofluorocarbon compounds for etching semiconductor structuresAIR LIQUIDE AMERICAN·Filed 2020·Granted Oct 24, 2023·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →