Inventor · disambiguated record
Farhad G. Mizori
Also filed as: MIZORI FARHAD · MIZORI FARHAD G
16 granted patents·12 pending applications·547 citations·filing 1998–2021
95Inventor score
Top patents by PatentIndex Score
28 records- 0198US7517925B2Benzoxazines, thermosetting resins comprised thereof, and methods for use thereofHENKEL CORP·Filed 2003·Granted Apr 14, 2009·87 cites·13 claims
- 0298US7285613B2Free-radical curable polyesters and methods for use thereofDESIGNER MOLECULES INC·Filed 2005·Granted Oct 23, 2007·41 cites·6 claims
- 0398US6743852B2Benzoxazines, thermosetting resins comprised thereof, and methods for use thereofHENKEL CORP·Filed 2001·Granted Jun 1, 2004·102 cites·29 claims
- 0497US7208566B2Imide-linked maleimide and polymaleimide compoundsDESIGNER MOLECULES INC·Filed 2004·Granted Apr 24, 2007·66 cites·9 claims
- 0596US7875688B2Free-radical curable polyesters and methods for use thereofDESIGNER MOLECULES INC·Filed 2007·Granted Jan 25, 2011·17 cites·19 claims
- 0696US7157587B2Imide-extended liquid bismaleimide resinDESIGNER MOLECULES INC·Filed 2004·Granted Jan 2, 2007·60 cites·16 claims
- 0795US5973166AMethod for the preparation of maleimidesDEXTER CORP·Filed 1998·Granted Oct 26, 1999·82 cites·18 claims
- 0893US8415812B2Materials and methods for stress reduction in semiconductor wafer passivation layersDERSHEM STEPHEN M·Filed 2010·Granted Apr 9, 2013·10 cites·20 claims
- 0993US7884174B2Imide-linked maleimide and polymaleimide compoundsDESIGNER MOLECULES INC·Filed 2007·Granted Feb 8, 2011·16 cites·21 claims
- 1093US7786234B2Free-radical curable polyesters and methods for use thereofDESIGNER MOLECULES INC·Filed 2007·Granted Aug 31, 2010·17 cites·13 claims
- 1192US7777064B2Adhesive compositions containing cyclic siloxanes and methods for use thereofDESIGNER MOLECULES INC·Filed 2006·Granted Aug 17, 2010·28 cites·10 claims
- 1287US8816021B2Curable composition with rubber-like propertiesMIZORI FARHAD G·Filed 2011·Granted Aug 26, 2014·5 cites·20 claims
- 1387US8710682B2Materials and methods for stress reduction in semiconductor wafer passivation layersDESIGNER MOLECULES INC·Filed 2013·Granted Apr 29, 2014·8 cites·22 claims
- 1486US8158748B2Hetero-functional compounds and methods for use thereofDERSHEM STEPHEN M·Filed 2009·Granted Apr 17, 2012·5 cites·7 claims
- 1583US8513375B2Imide-linked maleimide and polymaleimide compoundsMIZORI FARHAD G·Filed 2011·Granted Aug 20, 2013·3 cites·10 claims
- 1668US2018237668A1Anionic curable compositionsDESIGNER MOLECULES INC·Filed 2016·Application pending·0 cites
- 1765US9278909B2Amide-extended crosslinking compounds and methods for use thereofDESIGNER MOLECULES INC·Filed 2013·Granted Mar 8, 2016·0 cites·1 claims
- 1859US2023143643A1Low dk copper clad laminate compositionsDESIGNER MOLECULES INC·Filed 2020·Application pending·0 cites
- 1958US2014275413A1Heat and moisture resistant anaerobic adhesives and sealantsDESIGNER MOLECULES INC·Filed 2014·Application pending·0 cites
- 2052US2016237311A1Low dielectric constant, low dielectric dissipation factor coatings, films and adhesivesMIZORI FARHAD G·Filed 2014·Application pending·0 cites
- 2149US2008262191A1Methods for the preparation of imides, maleimides and maleimide-terminated polyimide compoundsMIZORI FARHAD G·Filed 2008·Application pending·0 cites
- 2248US2023095931A1Uv-curable resin compositions suitable for redistribution layersDESIGNER MOLECULES INC·Filed 2021·Application pending·0 cites
- 2344US2005267254A1Functionalized urethanes and methods for use thereofMIZORI FARHAD G·Filed 2005·Application pending·0 cites
- 2443US2015344627A1Low modulus negative tone, aqueous developable photoresistDESIGNER MOLECULES INC·Filed 2013·Application pending·0 cites
- 2542US2022213267A1Extreme high temperature stable adhesives and coatingsDESIGNER MOLECULES INC·Filed 2020·Application pending·0 cites
- 2641US2022204696A1Phenolic functionalized polyimides and compositions thereofDESIGNER MOLECULES INC·Filed 2020·Application pending·0 cites
- 2740US2021301133A1Curable polyimidesDESIGNER MOLECULES INC·Filed 2018·Application pending·0 cites
- 2840US2022204766A1High molecular weight flexible curable polyimidesDESIGNER MOLECULES INC·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →