Inventor · disambiguated record
Fabian Mohn
Also filed as: MOHN FABIAN
16 granted patents·4 pending applications·19 citations·filing 2017–2023
88Inventor score
Files withABB SCHWEIZ AG8HITACHI ENERGY SWITZERLAND AG5HITACHI ENERGY LTD4AUDI AG2ABB POWER GRIDS SWITZERLAND AG1
Top patents by PatentIndex Score
20 records- 0181US10283436B2Power electronics module with first and second coolersABB SCHWEIZ AG·Filed 2017·Granted May 7, 2019·4 cites·20 claims
- 0281US10283454B2Power semiconductor moduleABB SCHWEIZ AG·Filed 2017·Granted May 7, 2019·4 cites·20 claims
- 0380US10079193B2Semiconductor moduleABB SCHWEIZ AG·Filed 2017·Granted Sep 18, 2018·4 cites·20 claims
- 0477US11343943B1Heat dissipation for power switchesABB SCHWEIZ AG·Filed 2020·Granted May 24, 2022·1 cites·20 claims
- 0573US11538734B2Power semiconductor package with highly reliable chip topsideHITACHI ENERGY SWITZERLAND AG·Filed 2019·Granted Dec 27, 2022·2 cites·20 claims
- 0673US11018117B2Half-bridge module with coaxial arrangement of the DC terminalsABB POWER GRIDS SWITZERLAND AG·Filed 2019·Granted May 25, 2021·2 cites·20 claims
- 0772US10636732B2Power module based on multi-layer circuit boardABB SCHWEIZ AG·Filed 2018·Granted Apr 28, 2020·2 cites·20 claims
- 0852US12068174B2Arrangement of a power semiconductor module and a coolerHITACHI ENERGY LTD·Filed 2020·Granted Aug 20, 2024·0 cites·23 claims
- 0952US11348896B2Method for producing a semiconductor module by using adhesive attachment prior to sinteringAUDI AG·Filed 2020·Granted May 31, 2022·0 cites·11 claims
- 1050US12512413B2Electrical contact arrangement, power semiconductor module, method for manufacturing an electrical contact arrangement and method for manufacturing a power semiconductor moduleHITACHI ENERGY LTD·Filed 2021·Granted Dec 30, 2025·0 cites·20 claims
- 1149US2024014096A1Power module comprising at least one semiconductor module, and a method for manufacturing a power moduleHITACHI ENERGY SWITZERLAND AG·Filed 2023·Application pending·0 cites
- 1248US11189556B2Manufacturing of a power semiconductor moduleABB SCHWEIZ AG·Filed 2019·Granted Nov 30, 2021·0 cites·25 claims
- 1348US2024186199A1Semiconductor power module and method for manufacturing a semiconductor power moduleHITACHI ENERGY LTD·Filed 2022·Application pending·0 cites
- 1447US10950516B2Resin encapsulated power semiconductor module with exposed terminal areasABB SCHWEIZ AG·Filed 2019·Granted Mar 16, 2021·0 cites·20 claims
- 1546US2024079279A1Power semiconductor module, method for manufacturing the same and electrical converterHITACHI ENERGY SWITZERLAND AG·Filed 2021·Application pending·0 cites
- 1646US2024030101A1Power Module and Method for Producing a Power ModuleHITACHI ENERGY SWITZERLAND AG·Filed 2021·Application pending·0 cites
- 1744US12016162B2Electric power converter device with improved integration of cooler frameAUDI AG·Filed 2020·Granted Jun 18, 2024·0 cites·14 claims
- 1843US11749633B2Power semiconductor module with laser-welded leadframeHITACHI ENERGY SWITZERLAND AG·Filed 2020·Granted Sep 5, 2023·0 cites·22 claims
- 1942US12068290B2Power semiconductor module with low inductance gate crossingHITACHI ENERGY LTD·Filed 2020·Granted Aug 20, 2024·0 cites·19 claims
- 2039US10192800B2Semiconductor deviceABB SCHWEIZ AG·Filed 2017·Granted Jan 29, 2019·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →