Inventor · disambiguated record
Fabien Quercia
Also filed as: QUERCIA FABIEN
13 granted patents·6 pending applications·2 citations·filing 2010–2025
84Inventor score
Top patents by PatentIndex Score
19 records- 0184US2025070081A1Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic deviceST MICROELECTRONICS GRENOBLE 2·Filed 2024·Application pending·0 cites
- 0277US12278155B2Integrated circuit package with heat sink and manufacturing method thereofST MICROELECTRONICS GRENOBLE 2·Filed 2021·Granted Apr 15, 2025·1 cites·18 claims
- 0377US12170262B2Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic deviceST MICROELECTRONICS GRENOBLE 2·Filed 2022·Granted Dec 17, 2024·0 cites·10 claims
- 0476US12272922B2Electronic chip support device and corresponding manufacturing methodST MICROELECTRONICS GRENOBLE 2·Filed 2024·Granted Apr 8, 2025·0 cites·20 claims
- 0573US11817377B2Electronics unit with integrated metallic patternST MICROELECTRONICS GRENOBLE 2·Filed 2022·Granted Nov 14, 2023·0 cites·15 claims
- 0667US11437306B2Electronics unit with integrated metallic patternST MICROELECTRONICS GRENOBLE 2·Filed 2021·Granted Sep 6, 2022·0 cites·14 claims
- 0766US11557566B2Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic deviceST MICROELECTRONICS GRENOBLE 2·Filed 2020·Granted Jan 17, 2023·0 cites·14 claims
- 0863US11916353B2Electronic chip support device and corresponding manufacturing methodST MICROELECTRONICS GRENOBLE 2·Filed 2021·Granted Feb 27, 2024·0 cites·20 claims
- 0961US12417953B2ConnectorST MICROELECTRONICS GRENOBLE 2·Filed 2022·Granted Sep 16, 2025·0 cites·20 claims
- 1061US10643970B2Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic deviceST MICROELECTRONICS GRENOBLE 2·Filed 2019·Granted May 5, 2020·0 cites·5 claims
- 1160US2025218884A1Integrated circuit package with heat sink and manufacturing method thereofST MICROELECTRONICS GRENOBLE 2·Filed 2025·Application pending·0 cites
- 1255US12288961B2Electronic device comprising a transparent encapsulation structure housing an electronic chip and corresponding production methodST MICROELECTRONICS GRENOBLE 2·Filed 2021·Granted Apr 29, 2025·0 cites·26 claims
- 1354US10224306B2Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic deviceST MICROELECTRONICS GRENOBLE 2·Filed 2017·Granted Mar 5, 2019·0 cites·6 claims
- 1449US2023318165A1Electronic deviceST MICROELECTRONICS GRENOBLE 2·Filed 2023·Application pending·0 cites
- 1545US2023081711A1Wire bonding toolST MICROELECTRONICS GRENOBLE 2·Filed 2022·Application pending·0 cites
- 1643US10897822B2Electronic device comprising an electronic component mounted on a support substrate and assembly methodST MICROELECTRONICS GRENOBLE 2·Filed 2020·Granted Jan 19, 2021·0 cites·14 claims
- 1741US9337160B2Copper wire receiving padVEYCHARD DAMIEN·Filed 2012·Granted May 10, 2016·1 cites·18 claims
- 1838US2020196433A1Method for mounting componentST MICROELECTRONICS GRENOBLE 2·Filed 2019·Application pending·0 cites
- 1935US2011018135A1Method of electrically connecting a wire to a pad of an integrated circuit chip and electronic deviceST MICROELECTRONICS GRENOBLE 2·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →