Inventor · disambiguated record

Fangxin Tian

Also filed as: TIAN FANGXIN

1 granted patent·1 citations·filing 2024–2024

14Inventor score

Technology areasH10P

Files withHWATSING BEIJING TECH CO LTD1

Top patents by PatentIndex Score

1 record

0175US12109664B1Method for determining thickness of metal film of wafer, polishing device, and mediumHWATSING BEIJING TECH CO LTD·Filed 2024·Granted Oct 8, 2024·1 cites·15 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →