Inventor · disambiguated record
Farzaneh Yahyaei-Moayyed
Also filed as: YAHYAEI-MOAYYED FARZANEH
8 granted patents·1 pending application·150 citations·filing 2000–2021
89Inventor score
Files withINTEL CORP9
Top patents by PatentIndex Score
9 records- 0187US6586684B2Circuit housing clamp and method of manufacture thereforINTEL CORP·Filed 2001·Granted Jul 1, 2003·42 cites·17 claims
- 0283US6558181B2System and method for package socket with embedded power and ground planesINTEL CORP·Filed 2000·Granted May 6, 2003·30 cites·7 claims
- 0378US6975518B2Printed circuit board housing clampINTEL CORP·Filed 2003·Granted Dec 13, 2005·25 cites·21 claims
- 0471US6428358B1Socket with embedded conductive structure and method of fabrication thereforINTEL CORP·Filed 2000·Granted Aug 6, 2002·13 cites·14 claims
- 0570US6877223B2Method of fabrication for a socket with embedded conductive structureINTEL CORP·Filed 2002·Granted Apr 12, 2005·16 cites·8 claims
- 0665US6584685B2System and method for package socket with embedded power and ground planesINTEL CORP·Filed 2001·Granted Jul 1, 2003·10 cites·9 claims
- 0757US7212395B2Capacitor design for controlling equivalent series resistanceINTEL CORP·Filed 2004·Granted May 1, 2007·8 cites·22 claims
- 0854US6784532B2Power/ground configuration for low impedance integrated circuitINTEL CORP·Filed 2002·Granted Aug 31, 2004·6 cites·20 claims
- 0944US2021183846A1Enhanced integrated circuit component power deliveryINTEL CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →