Inventor · disambiguated record
Fan Yeung
Also filed as: YEUNG FAN
4 granted patents·77 citations·filing 2008–2011
75Inventor score
Top patents by PatentIndex Score
4 records- 0195US7670939B2Semiconductor chip bump connection apparatus and methodATI TECHNOLOGIES ULC·Filed 2008·Granted Mar 2, 2010·67 cites·16 claims
- 0270US8779598B2Method and apparatuses for integrated circuit substrate manufactureYEUNG FAN·Filed 2011·Granted Jul 15, 2014·5 cites·20 claims
- 0367US7646083B2I/O connection scheme for QFN leadframe and package structuresBROADCOM CORP·Filed 2008·Granted Jan 12, 2010·4 cites·18 claims
- 0465US8378471B2Semiconductor chip bump connection apparatus and methodATI TECHNOLOGIES ULC·Filed 2010·Granted Feb 19, 2013·1 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →