Inventor · disambiguated record
Feibiao Chen
Also filed as: CHEN FEIBIAO
13 granted patents·1 pending application·8 citations·filing 2014–2020
83Inventor score
Files withSHANGHAI MICRO ELECTRONICS EQUIPMENT GROUP CO LTD10SHANGHAI MICROELECTRONICS EQUI2JIANGXI JIAYIN SCIENCE AND TECH LTD1MIKESKA KURT R1
Top patents by PatentIndex Score
14 records- 0182US10040717B1Thick-film paste with multiple discrete frits and methods for contacting crystalline silicon solar cell emitter surfacesMIKESKA KURT R·Filed 2017·Granted Aug 7, 2018·4 cites·20 claims
- 0276US11551948B2Semiconductor manufacturing apparatusSHANGHAI MICRO ELECTRONICS EQUIPMENT GROUP CO LTD·Filed 2018·Granted Jan 10, 2023·2 cites·12 claims
- 0366US10658327B1Chip bonding apparatus and bonding methodSHANGHAI MICRO ELECTRONICS EQUIPMENT GROUP CO LTD·Filed 2017·Granted May 19, 2020·1 cites·11 claims
- 0465US10748800B2Chip bonding apparatus and methodSHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO LTD·Filed 2017·Granted Aug 18, 2020·1 cites·17 claims
- 0542US9857702B2Focusing leveling deviceSHANGHAI MICROELECTRONICS EQUI·Filed 2014·Granted Jan 2, 2018·0 cites·10 claims
- 0641US10763235B2Batch bonding apparatus and bonding methodSHANGHAI MICRO ELECTRONICS EQUIPMENT GROUP CO LTD·Filed 2017·Granted Sep 1, 2020·0 cites·12 claims
- 0740US11037900B2Chip bonding device and bonding method thereofSHANGHAI MICRO ELECTRONICS EQUIPMENT GROUP CO LTD·Filed 2017·Granted Jun 15, 2021·0 cites·19 claims
- 0839US2022069150A1Non-contacting thick-film busbar pastes for crystalline silicon solar cell emitter surfacesJIANGXI JIAYIN SCIENCE AND TECH LTD·Filed 2020·Application pending·0 cites
- 0938US10770320B2Universal chip batch-bonding apparatus and methodSHANGHAI MICRO ELECTRONICS EQUIPMENT GROUP CO LTD·Filed 2017·Granted Sep 8, 2020·0 cites·12 claims
- 1037US11081380B2Chip bonding deviceSHANGHAI MICRO ELECTRONICS EQUIPMENT GROUP CO LTD·Filed 2018·Granted Aug 3, 2021·0 cites·18 claims
- 1133US10656507B2Focusing and leveling measurement device and methodSHANGHAI MICRO ELECTRONICS EQUIPMENT GROUP CO LTD·Filed 2017·Granted May 19, 2020·0 cites·19 claims
- 1233US10274840B2Adaptive groove focusing and leveling device and methodSHANGHAI MICRO ELECTRONICS EQUIPMENT GROUP CO LTD·Filed 2015·Granted Apr 30, 2019·0 cites·11 claims
- 1332US10903105B2Flip chip bonding device and bonding methodSHANGHAI MICRO ELECTRONICS EQUIPMENT GROUP CO LTD·Filed 2017·Granted Jan 26, 2021·0 cites·12 claims
- 1432US10197923B2Exposure device and out-of-focus and tilt error compensation methodSHANGHAI MICROELECTRONICS EQUI·Filed 2015·Granted Feb 5, 2019·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →