Inventor · disambiguated record
Feng Chen
Also filed as: CHEN FENG · CHEN FENG-LING
21 granted patents·5 pending applications·397 citations·filing 1999–2018
96Inventor score
Files withCHARTERED SEMICONDUCTOR MFG19NANYA TECHNOLOGY CORP3HEWLETT PACKARD DEVELOPMENT CO1UNIV TSINGHUA1YU CHIEN-AN1
Top patents by PatentIndex Score
26 records- 0188US6376376B1Method to prevent CU dishing during damascene formationCHARTERED SEMICONDUCTOR MFG·Filed 2001·Granted Apr 23, 2002·60 cites·29 claims
- 0285US7446039B2Integrated circuit system with dummy regionCHARTERED SEMICONDUCTOR MFG·Filed 2006·Granted Nov 4, 2008·12 cites·8 claims
- 0385US6281082B1Method to form MOS transistors with a common shallow trench isolation and interlevel dielectric gap fillCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Aug 28, 2001·52 cites·20 claims
- 0484US6204137B1Method to form transistors and local interconnects using a silicon nitride dummy gate techniqueCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Mar 20, 2001·44 cites·20 claims
- 0583US6306723B1Method to form shallow trench isolations without a chemical mechanical polishCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Oct 23, 2001·42 cites·20 claims
- 0681US6284644B1IMD scheme by post-plasma treatment of FSG and TEOS oxide capping layerCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Sep 4, 2001·38 cites·44 claims
- 0778US6451687B1Intermetal dielectric layer for integrated circuitsCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Sep 17, 2002·19 cites·10 claims
- 0868US6613649B2Method for buffer STI scheme with a hard mask layer as an oxidation barrierCHARTERED SEMICONDUCTOR MFG·Filed 2001·Granted Sep 2, 2003·16 cites·21 claims
- 0967US6664190B2Pre STI-CMP planarization schemeCHARTERED SEMICONDUCTOR MFG·Filed 2001·Granted Dec 16, 2003·16 cites·26 claims
- 1061US6274485B1Method to reduce dishing in metal chemical-mechanical polishingCHARTERED SEMICONDUCTOR MFG·Filed 1999·Granted Aug 14, 2001·32 cites·36 claims
- 1160US6376378B1Polishing apparatus and method for forming an integrated circuitCHARTERED SEMICONDUCTOR MFG·Filed 1999·Granted Apr 23, 2002·21 cites·28 claims
- 1257US7156726B1Polishing apparatus and method for forming an integrated circuitCHARTERED SEMICONDUCTOR MFG·Filed 2001·Granted Jan 2, 2007·6 cites·6 claims
- 1354US6964598B1Polishing apparatus and method for forming an integrated circuitCHARTERED SEMICONDUCTOR MFG·Filed 2001·Granted Nov 15, 2005·4 cites·7 claims
- 1452US2019088488A1Method for manufacturing semiconductor deviceNANYA TECHNOLOGY CORP·Filed 2018·Application pending·0 cites
- 1551US8536635B1Semiconductor structure and fabrication method thereofYU CHIEN-AN·Filed 2012·Granted Sep 17, 2013·1 cites·11 claims
- 1651US6613648B1Shallow trench isolation using TEOS cap and polysilicon pullbackCHARTERED SEMICONDUCTOR MFG·Filed 2002·Granted Sep 2, 2003·5 cites·15 claims
- 1751US6103569AMethod for planarizing local interconnectsCHARTERED SEMICONDUCTOR MFG·Filed 1999·Granted Aug 15, 2000·17 cites·14 claims
- 1850US7741719B2Integrated circuit system with dummy regionCHARTERED SEMICONDUCTOR MFG·Filed 2008·Granted Jun 22, 2010·0 cites·10 claims
- 1949US6528886B2Intermetal dielectric layer for integrated circuitsCHARTERED SEMICONDUCTOR MFG·Filed 2002·Granted Mar 4, 2003·2 cites·8 claims
- 2048US2015097228A1Method for manufacturing semiconductor deviceNANYA TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
- 2147US2017133230A1Semiconductor device having vertical silicon pillar transistorNANYA TECHNOLOGY CORP·Filed 2017·Application pending·0 cites
- 2246US7060573B2Extended poly buffer STI schemeCHARTERED SEMICONDUCTOR MFG·Filed 2001·Granted Jun 13, 2006·2 cites·31 claims
- 2342US11341380B2Consumable characteristic identificationHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted May 24, 2022·0 cites·15 claims
- 2441US6443809B1Polishing apparatus and method for forming an integrated circuitCHARTERED SEMICONDUCTOR MFG·Filed 1999·Granted Sep 3, 2002·8 cites·20 claims
- 2536US2008074643A1Medical devices with color characteristics and use thereofUNIV TSINGHUA·Filed 2007·Application pending·0 cites
- 2634US2005113002A1CMP polishing heads retaining ring groove design for microscratch reductionFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →