Inventor · disambiguated record
Fernando Gonzalez Lenero
Also filed as: GONZALEZ LENERO FERNANDO
4 granted patents·3 pending applications·2 citations·filing 2017–2024
59Inventor score
Files withINTEL CORP7
Top patents by PatentIndex Score
7 records- 0176US12131977B2Electronic systems with inverted circuit board with heat sink to chassis attachmentINTEL CORP·Filed 2023·Granted Oct 29, 2024·0 cites·20 claims
- 0263US11842943B2Electronic systems with inverted circuit board with heat sink to chassis attachmentINTEL CORP·Filed 2020·Granted Dec 12, 2023·0 cites·22 claims
- 0362US11532906B2Hybrid socket for higher thermal design point processor supportINTEL CORP·Filed 2018·Granted Dec 20, 2022·2 cites·23 claims
- 0461US2025089192A1Composite backplate architectures for backside power delivery and associated methodsINTEL CORP·Filed 2024·Application pending·0 cites
- 0556US2024407092A1Covers for integrated circuit package socketsINTEL CORP·Filed 2024·Application pending·0 cites
- 0648US2023027076A1Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 0732US10408860B2Interconnection system with flexible pinsINTEL CORP·Filed 2017·Granted Sep 10, 2019·0 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →