Inventor · disambiguated record

Fengze Hou

Also filed as: Hou fengze

1 granted patent·19 citations·filing 2015–2015

39Inventor score

Technology areasH10W

Files withNAT CENTER FOR ADVANCED PACKAGING CO LTD1

Top patents by PatentIndex Score

1 record

0185US9653378B2Heat dissipation solution for advanced chip packagesNAT CENTER FOR ADVANCED PACKAGING CO LTD·Filed 2015·Granted May 16, 2017·19 cites·14 claims

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