Inventor · disambiguated record

Feng-Ger Hsiau

Also filed as: HSIAU FENG-GER

1 granted patent·1 pending application·24 citations·filing 2001–2003

43Inventor score

Technology areasH10W

Files withCHUNG SHAN INST OF SCIENCE1

Top patents by PatentIndex Score

2 records

0167US7222419B2Method of fabricating a ceramic substrate with a thermal conductive plug of a multi-chip packageCHUNG SHAN INST OF SCIENCE·Filed 2001·Granted May 29, 2007·24 cites·23 claims
0225US2004045656A1Method of fabricating a ceramic substrate with a thermal conductive plug of a multi-chip packageFiled 2003·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →