Inventor · disambiguated record
Feng-Chien Hsieh
Also filed as: HSIEH FENG-CHIEN
40 granted patents·30 pending applications·27 citations·filing 2008–2025
95Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD64HSIEH FENG-CHIEN3NEXPOWER TECHNOLOGY CORP2TRAIWAN SEMICONDUCTOR MFG COMPANY LTD1
Top patents by PatentIndex Score
70 records- 0198US11482506B2Edge-trimming methods for wafer bonding and dicingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 25, 2022·8 cites·20 claims
- 0295US11810933B2Image sensor device and fabrication method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 7, 2023·3 cites·20 claims
- 0392US12364043B2Image sensor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 15, 2025·1 cites·20 claims
- 0489US12051704B2Pixel array including octagon pixel sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 30, 2024·1 cites·20 claims
- 0589US11985438B2Pixel array including dark pixel sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 14, 2024·2 cites·20 claims
- 0686US2025314777A1Pixel array including time-of-flight sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0786US2025324797A1Semiconductor arrangement with isolation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0885US12021105B2Pixel array including octagon pixel sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 25, 2024·1 cites·20 claims
- 0985US2025318300A1Image sensor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1085US2025318289A1Back side illuminated image sensor device with select dielectric layers on the backside and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1184US2025126911A1Methods for forming optical blocking structures for black level correction pixels in an image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1283US12408464B2Semiconductor arrangement with isolation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 2, 2025·0 cites·20 claims
- 1383US12386073B2Pixel array including time-of-flight sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 12, 2025·0 cites·20 claims
- 1482US11810936B2Pixel array including air gap reflection structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 7, 2023·1 cites·20 claims
- 1581US12407809B2Pixel array including dark pixel sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 2, 2025·0 cites·20 claims
- 1681US12382734B2Back side illuminated image sensor device with select dielectric layers on the backside and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 5, 2025·0 cites·20 claims
- 1781US12211869B2Optical blocking structures for black level correction pixels in an image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 28, 2025·0 cites·20 claims
- 1881US11670651B2Pixel array including octagon pixel sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 6, 2023·1 cites·20 claims
- 1979US2024387595A1Image Sensors With Stress Adjusting LayersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2078US12469752B2Mid-manufacturing semiconductor wafer layer testingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 11, 2025·0 cites·20 claims
- 2178US12277795B2Optical fingerprint sensor with enhanced anti-counterfeiting featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 15, 2025·0 cites·20 claims
- 2278US2024386743A1Optical fingerprint sensor with enhanced anti-counterfeiting featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2378US2024379705A1Semiconductor arrangement and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2478US2024332325A1Pixel array including octagon pixel sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2578US2024395638A1Mid-manufacturing semiconductor wafer layer testingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2676US12154933B2Image sensors with stress adjusting layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 26, 2024·0 cites·20 claims
- 2776US2025318313A1Integration of solar cell and image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2875US11837619B2Semiconductor arrangement with isolation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 5, 2023·0 cites·20 claims
- 2975US2023402484A1Image sensor with high quantum efficiencyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3074US12471408B2Semiconductor structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 11, 2025·0 cites·20 claims
- 3174US12457812B2Semiconductor structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 28, 2025·0 cites·20 claims
- 3274US7919710B2Solar cell containing silicon and chalcopyrite semiconductor layersNEXPOWER TECHNOLOGY CORP·Filed 2008·Granted Apr 5, 2011·6 cites·23 claims
- 3374US2023387171A1Deep trench isolation structure in a pixel sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3474US2023369361A1Fast charge transfer floating diffusion region for a photodetector and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3574US2023387152A1Pixel sensor including a transfer finfetTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3674US2023378214A1Pixel array including air gap reflection structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3773US12396285B2Integration of solar cell and image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 19, 2025·0 cites·20 claims
- 3873US12164034B2Pixel array including time-of-flight sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 10, 2024·0 cites·16 claims
- 3973US2025063837A1Pixel array including octagon pixel sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4072US12166048B2Pixel array including octagon pixel sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
- 4171US12243894B2Stacked image sensors and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 4, 2025·0 cites·20 claims
- 4271US11996428B2Optical blocking structures for black level correction pixels in an image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 28, 2024·0 cites·20 claims
- 4370US12324254B2Back side illuminated image sensor device with select dielectric layers on the backside and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 3, 2025·0 cites·20 claims
- 4470US12243898B2Image sensor with high quantum efficiencyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 4, 2025·0 cites·20 claims
- 4570US12033902B2Mid-manufacturing semiconductor wafer layer testingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 9, 2024·0 cites·20 claims
- 4669US12142630B2Vertically arranged semiconductor pixel sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 12, 2024·0 cites·20 claims
- 4769US2022367546A1Photodetector using a buried gate electrode for a transfer transistor and methods of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 4868US12446338B2Method for manufacturing image sensor including forming FinFET transfer gate having a plurality of channel fins above a p-type regionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 14, 2025·0 cites·20 claims
- 4967US11837614B2Fast charge transfer floating diffusion region for a photodetector and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 5, 2023·0 cites·20 claims
- 5066US12342647B2Semiconductor arrangement and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 24, 2025·0 cites·20 claims
Showing the top 50 of 70 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →