Inventor · disambiguated record
Feng-Cheng Hsu
Also filed as: HSU FENG-CHENG
113 granted patents·14 pending applications·360 citations·filing 2007–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD118TAIWAN SEMICONDUCTOR MFG5TPK TOUCH SOLUTIONS XIAMEN INC2CHEN CHUN-KUANG1HSU FENG-CHENG1
Top patents by PatentIndex Score
127 records- 0198US11942408B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 26, 2024·4 cites·20 claims
- 0298US11791301B2Chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 17, 2023·3 cites·20 claims
- 0398US10741537B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 11, 2020·36 cites·20 claims
- 0497US11756928B2Multi-chip packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 12, 2023·2 cites·20 claims
- 0597US11735572B2Integrated circuit package and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 22, 2023·5 cites·21 claims
- 0697US11393746B2Reinforcing package using reinforcing patchesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 19, 2022·4 cites·20 claims
- 0797US11342255B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·4 cites·20 claims
- 0897US10804244B2Semiconductor package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 13, 2020·4 cites·20 claims
- 0997US10784220B2Plurality of semiconductor devices encapsulated by a molding material attached to a redistribution layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 22, 2020·17 cites·19 claims
- 1097US10535597B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 14, 2020·16 cites·20 claims
- 1197US9985006B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 29, 2018·14 cites·20 claims
- 1297US9935080B2Three-layer Package-on-Package structure and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 3, 2018·15 cites·10 claims
- 1397US9425121B2Integrated fan-out structure with guiding trenches in buffer layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 23, 2016·25 cites·20 claims
- 1496US12125755B2Chip package structure with cavity in interposerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 22, 2024·2 cites·20 claims
- 1596US11282759B2Chip package structure having warpage control and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 22, 2022·4 cites·20 claims
- 1696US10763239B2Multi-chip wafer level packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 1, 2020·13 cites·17 claims
- 1796US10546830B2Chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 28, 2020·9 cites·20 claims
- 1896US10535632B2Semiconductor package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 14, 2020·15 cites·20 claims
- 1996US10515827B2Method for forming chip package with recessed interposer substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·12 cites·20 claims
- 2095US12381180B2Multi-chip packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 5, 2025·1 cites·20 claims
- 2195US11915992B2Method for forming package structure with lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 27, 2024·2 cites·20 claims
- 2295US10727198B2Semiconductor package and method manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 28, 2020·9 cites·20 claims
- 2393US10283474B2Chip package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 7, 2019·6 cites·20 claims
- 2493US2025357432A1Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2592US11456257B2Semiconductor package with dual sides of metal routingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 27, 2022·6 cites·20 claims
- 2692US10867924B2Semiconductor package with redistribution structure and pre-made substrate on opposing sides for dual-side metal routingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·6 cites·20 claims
- 2792US10163876B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 25, 2018·5 cites·20 claims
- 2892US9947629B2Method of forming contact holes in a fan out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 17, 2018·6 cites·20 claims
- 2991US11417620B2Semiconductor device encapsulated by molding material attached to redestribution layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 16, 2022·2 cites·20 claims
- 3091US11335672B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 17, 2022·2 cites·20 claims
- 3191US11189596B2Methods of forming multi-chip wafer level packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 30, 2021·2 cites·20 claims
- 3291US10163860B2Semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 25, 2018·8 cites·20 claims
- 3391US9997471B2Semiconductor package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 12, 2018·6 cites·20 claims
- 3490US11011447B2Semiconductor package and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 18, 2021·4 cites·20 claims
- 3590US10515930B2Three-layer package-on-package structure and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·4 cites·20 claims
- 3689US11443993B2Chip package structure with cavity in interposerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 13, 2022·2 cites·20 claims
- 3789US10050024B2Semiconductor package and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 14, 2018·5 cites·20 claims
- 3889US9627346B2Underfill pattern with gapTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Apr 18, 2017·12 cites·20 claims
- 3988US9633895B2Integrated fan-out structure with guiding trenches in buffer layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 25, 2017·4 cites·20 claims
- 4088US8741552B2Double patterning strategy for contact hole and trench in photolithographyCHEN CHUN-KUANG·Filed 2010·Granted Jun 3, 2014·9 cites·21 claims
- 4187US12500158B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 16, 2025·0 cites·20 claims
- 4287US10665473B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 26, 2020·5 cites·14 claims
- 4387US7935477B2Double patterning strategy for contact hole and trenchTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted May 3, 2011·12 cites·18 claims
- 4487US2024387472A1Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4586US12506008B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 23, 2025·0 cites·20 claims
- 4686US10276551B2Semiconductor device package and method of forming semiconductor device packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·3 cites·14 claims
- 4786US2024347439A1Chip package having multiple chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4885US12322742B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 3, 2025·0 cites·20 claims
- 4985US12278156B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 15, 2025·0 cites·20 claims
- 5085US9911629B2Integrated passive device package and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 6, 2018·3 cites·20 claims
Showing the top 50 of 127 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →