Inventor · disambiguated record
Felix Koch
Also filed as: KOCH FELIX
7 granted patents·16 pending applications·16 citations·filing 2015–2025
77Inventor score
Files withDDP SPECIALTY ELECTRONIC MATERIALS US LLC14DDP SPECIALTY ELECTRONIC MAT US INC2DOW GLOBAL TECHNOLOGIES LLC2EMS PATENT AG2DDP SPECIALTY ELECTRONICS MAT US INC1
Top patents by PatentIndex Score
23 records- 0195US10233326B2Polyamide moulding compound, moulded article produced herefrom and also purposes of useEMS PATENT AG·Filed 2015·Granted Mar 19, 2019·10 cites·12 claims
- 0289US10392542B2Latent two-part polyurethane adhesives curable with infrared radiationDOW GLOBAL TECHNOLOGIES LLC·Filed 2016·Granted Aug 27, 2019·4 cites·20 claims
- 0387US2024110085A1High modulus, toughened one-component epoxy structural adhesives with high aspect ratio fillersDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2023·Application pending·0 cites
- 0483US2024301257A1Epoxy adhesive composition and method of useDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2024·Application pending·0 cites
- 0582US2024093072A1One-component toughened epoxy adhesivesDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2023·Application pending·0 cites
- 0677US10160860B2Reinforced polyamide moulding compositions and injection mouldings produced therefromEMS PATENT AG·Filed 2015·Granted Dec 25, 2018·1 cites·18 claims
- 0774US11274236B2One-component toughened epoxy adhesives containing a mixture of latent curing agentsDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2018·Granted Mar 15, 2022·1 cites·7 claims
- 0873US2021009871A1High modulus, toughened one-component epoxy structural adhesives with high aspect ratio fillersDDP SPECIALTY ELECTRONIC MAT US INC·Filed 2020·Application pending·0 cites
- 0971US2025154394A1One-component toughened epoxy adhesives with improved humidity resistanceDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2025·Application pending·0 cites
- 1067US2022195267A1One-component toughened epoxy adhesives with improved humidity resistanceDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2020·Application pending·0 cites
- 1166US2022204820A1Epoxy adhesive composition and method of useDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2020·Application pending·0 cites
- 1263US11674063B2Epoxy resin adhesive compositionsDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2018·Granted Jun 13, 2023·0 cites·14 claims
- 1363US2024376353A1Two-component structural adhesiveDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2022·Application pending·0 cites
- 1463US2018258329A1High modulus, toughened one-component epoxy structural adhesives with high aspect ratio fillersDOW GLOBAL TECHNOLOGIES LLC·Filed 2016·Application pending·0 cites
- 1562US2021130663A1One-component toughened epoxy adhesivesDDP SPECIALTY ELECTRONICS MAT US INC·Filed 2018·Application pending·0 cites
- 1659US2023365845A1One-component structural adhesiveDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2021·Application pending·0 cites
- 1757US2025382510A1Adhesive compositionDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2023·Application pending·0 cites
- 1856US2022411625A1Epoxy based thermal interface materialDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2020·Application pending·0 cites
- 1955US11820922B2Adhesive compositionDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2018·Granted Nov 21, 2023·0 cites·7 claims
- 2054US2022228045A1Accelerate cure polyurethane adhesive compositionDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2020·Application pending·0 cites
- 2150US2023060754A1Thermal interface material comprising multimodally distributed spherical fillersDDP SPECIALTY ELECTRONICS MAT US LLC·Filed 2021·Application pending·0 cites
- 2249US2021071054A1Polyurethane adhesive compositionsDDP SPECIALTY ELECTRONIC MAT US INC·Filed 2018·Application pending·0 cites
- 2348US12092812B2Device for the two-dimensionally scanning beam deflection of a light beamZEISS CARL AG·Filed 2020·Granted Sep 17, 2024·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →