Inventor · disambiguated record

Ferevdoun Maali

Also filed as: MAALI FEREVDOUN

1 granted patent·79 citations·filing 1997–1997

52Inventor score

Technology areasG06T

Files withUNIVERSAL INSTRUMENTS CORP1

Top patents by PatentIndex Score

1 record

0173US5694482ASystem and method for locating solder bumps on semiconductor chips or chip carriersUNIVERSAL INSTRUMENTS CORP·Filed 1997·Granted Dec 2, 1997·79 cites·22 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →