Inventor · disambiguated record
Feng-Po Tseng
Also filed as: TSENG FENG-PO
9 granted patents·2 pending applications·20 citations·filing 2003–2020
81Inventor score
Top patents by PatentIndex Score
11 records- 0185US9708437B2Resin formulations, resin polymers and composite materials comprising the resin polymersIND TECH RES INST·Filed 2015·Granted Jul 18, 2017·2 cites·20 claims
- 0275US10626219B2Polymers and resin composition employing the sameIND TECH RES INST·Filed 2017·Granted Apr 21, 2020·2 cites·12 claims
- 0370US8039537B2Modified bismaleimide resins, preparation method thereof and compositions comprising the sameIND TECH RES INST·Filed 2010·Granted Oct 18, 2011·2 cites·12 claims
- 0463US7834070B2Halogen-free and thermal resistant compositionIND TECH RES INST·Filed 2007·Granted Nov 16, 2010·3 cites·14 claims
- 0563US6809130B2Halogen-free, phosphorus-free flame-retardant advanced epoxy resin and an epoxy composition containing the sameIND TECH RES INST·Filed 2003·Granted Oct 26, 2004·11 cites·11 claims
- 0660US10752744B2Thermally conductive resin, resin composition, prepreg, and copper clad laminateIND TECH RES INST·Filed 2017·Granted Aug 25, 2020·0 cites·9 claims
- 0759US11247978B2Reversible crosslinking reactant compositionIND TECH RES INST·Filed 2020·Granted Feb 15, 2022·0 cites·8 claims
- 0859US10894853B2Furan-modified compound and oligomerIND TECH RES INST·Filed 2018·Granted Jan 19, 2021·0 cites·3 claims
- 0959US10858471B2Reversible crosslinking reactant compositionIND TECH RES INST·Filed 2018·Granted Dec 8, 2020·0 cites·11 claims
- 1046US2009235754A1Encapsulation composition for pressure signal transmission and sensorIND TECH RES INST·Filed 2009·Application pending·0 cites
- 1146US2007148469A1Encapsulation composition for pressure signal transmission and sensorTSENG FENG-PO·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →