Inventor · disambiguated record

Feiyan Wang

Also filed as: WANG FEIYAN

2 granted patents·0 citations·filing 2019–2021

26Inventor score

Technology areasB23K H10P

Files withYANGTZE MEMORY TECH CO LTD2

Top patents by PatentIndex Score

2 records

0164US11529700B2Systems and methods for laser dicing of bonded structuresYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Dec 20, 2022·0 cites·20 claims
0259US11938562B2Systems and methods for laser dicing of bonded structuresYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Mar 26, 2024·0 cites·20 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →