Inventor · disambiguated record
Fen Yu
Also filed as: YU FEN
6 granted patents·9 pending applications·11 citations·filing 2011–2024
69Inventor score
Technology areasH10W
Top patents by PatentIndex Score
15 records- 0182US9704797B2Waterfall wire bondingLU ZHONG·Filed 2011·Granted Jul 11, 2017·11 cites·11 claims
- 0256US2025239497A1Cavity tape for package protectionWESTERN DIGITAL TECH INC·Filed 2024·Application pending·0 cites
- 0355US2025385152A1Semiconductor device including an integrated wafer level heat sink window plateSANDISK TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 0455US2025391732A1Semiconductor device including an integrated tim-on-dieSANDISK TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 0553US12154860B2Method of forming a semiconductor device including vertical contact fingersWESTERN DIGITAL TECH INC·Filed 2021·Granted Nov 26, 2024·0 cites·18 claims
- 0653US11784135B2Semiconductor device including conductive bumps to improve EMI/RFI shieldingWESTERN DIGITAL TECH INC·Filed 2021·Granted Oct 10, 2023·0 cites·18 claims
- 0753US2025233102A1Wire bonding machine having a rotatable capillary to secure a bond wire to a connection pointSANDISK TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 0853US2024397735A1Packaged memory device with overhang support structureWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 0952US11810896B2Substrate component layout and bonding method for increased package capacityWESTERN DIGITAL TECH INC·Filed 2021·Granted Nov 7, 2023·0 cites·20 claims
- 1050US11488883B1Semiconductor device package having thermally conductive layers for heat dissipationWESTERN DIGITAL TECH INC·Filed 2021·Granted Nov 1, 2022·0 cites·20 claims
- 1150US2024413032A1Insulation layer for a semiconductor packageWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 1250US2025309018A1Encapsulated semiconductor packages including multifunctional interface material (mim) structuresSANDISK TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 1349US2024332156A1Substrate having an increased metal trace thicknessWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 1448US12027497B2Semiconductor device with unbalanced die stackupWESTERN DIGITAL TECH INC·Filed 2022·Granted Jul 2, 2024·0 cites·20 claims
- 1545US2023299034A1Semiconductor Device With Optimized Underfill FlowWESTERN DIGITAL TECH INC·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →