Inventor · disambiguated record

Felix Zeyss

Also filed as: ZEYSS FELIX

3 granted patents·4 pending applications·0 citations·filing 2021–2022

39Inventor score

Technology areasH10W

Files withSIEMENS AG7

Top patents by PatentIndex Score

7 records

0153US12482739B2Arrangement for a semiconductor arrangement comprising at least one passive component and a substrateSIEMENS AG·Filed 2022·Granted Nov 25, 2025·0 cites·15 claims
0249US12136603B2Semiconductor arrangement comprising a semiconductor element, a substrate and bond connecting meansSIEMENS AG·Filed 2022·Granted Nov 5, 2024·0 cites·20 claims
0344US2024379573A1Semiconductor assembly comprising at least two semiconductor elementsSIEMENS AG·Filed 2022·Application pending·0 cites
0443US11888407B2Power module having at least two power semiconductor arrangements that are contacted on a substrateSIEMENS AG·Filed 2021·Granted Jan 30, 2024·0 cites·17 claims
0542US2024038618A1Semiconductor module comprising at least one semiconductor elementSIEMENS AG·Filed 2021·Application pending·0 cites
0640US2024096844A1Bonded connection meansSIEMENS AG·Filed 2021·Application pending·0 cites
0739US2024088110A1Power converter with at least two power semiconductor modulesSIEMENS AG·Filed 2021·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →