Inventor · disambiguated record
Florian Brandl
Also filed as: BRANDL FLORIAN
12 granted patents·4 pending applications·8 citations·filing 2011–2024
83Inventor score
Files withINFINEON TECHNOLOGIES AG12ABB TECHNOLOGY AG2INFINEON TECHNOLOGIES AUSTRIA AG1ZWICKY DANIEL1
Top patents by PatentIndex Score
16 records- 0184US10899604B2Integration of stress decoupling and particle filter on a single wafer or in combination with a waferlevel packageINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jan 26, 2021·3 cites·10 claims
- 0274US8552317B2Metal-encapsulated, polyphase, gas-insulated busbar switch disconnector and earthing switchZWICKY DANIEL·Filed 2011·Granted Oct 8, 2013·4 cites·14 claims
- 0370US10996125B2Pressure sensors and method for forming a MEMS pressure sensorINFINEON TECHNOLOGIES AG·Filed 2018·Granted May 4, 2021·1 cites·33 claims
- 0468US12436050B2Pressure sensors and method for forming a MEMS pressure sensorINFINEON TECHNOLOGIES AG·Filed 2021·Granted Oct 7, 2025·0 cites·20 claims
- 0567US11505450B2Integration of stress decoupling and particle filter on a single wafer or in combination with a waferlevel packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Nov 22, 2022·0 cites·9 claims
- 0664US12498285B2Differential gas sensor with two sensor components and use for detection of gasesINFINEON TECHNOLOGIES AG·Filed 2022·Granted Dec 16, 2025·0 cites·24 claims
- 0763US12195325B2MEMS devices with support structures and associated production methodsINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 14, 2025·0 cites·20 claims
- 0862US11247895B2Segmented stress decoupling via frontside trenchingINFINEON TECHNOLOGIES AG·Filed 2020·Granted Feb 15, 2022·0 cites·17 claims
- 0957US10807862B1Segmented stress decoupling via frontside trenchingINFINEON TECHNOLOGIES AG·Filed 2019·Granted Oct 20, 2020·0 cites·17 claims
- 1056US10858245B2Deposition of protective material at wafer level in front end for early stage particle and moisture protectionINFINEON TECHNOLOGIES AG·Filed 2019·Granted Dec 8, 2020·0 cites·26 claims
- 1153US2024147871A1Electronic device including a superconducting electronic circuitINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 1252US10370244B2Deposition of protective material at wafer level in front end for early stage particle and moisture protectionINFINEON TECHNOLOGIES AG·Filed 2017·Granted Aug 6, 2019·0 cites·19 claims
- 1352US2024357947A1Electronic circuit with a superconducting electronic circuit unitINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 1445US10843916B2Mechanical stress decoupling for microelectromechanical systems (MEMS) elements with gel-fillingINFINEON TECHNOLOGIES AG·Filed 2019·Granted Nov 24, 2020·0 cites·19 claims
- 1538US2015034599A1High voltage interrupter unit with improved mechanical enduranceABB TECHNOLOGY AG·Filed 2014·Application pending·0 cites
- 1633US2014174895A1Contact arrangement for high voltage switchgear with contact arrangementABB TECHNOLOGY AG·Filed 2012·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Florian Brandl files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →