Inventor · disambiguated record
Floyd K. Eide
Also filed as: EIDE FLOYD · EIDE FLOYD K
9 granted patents·1,516 citations·filing 1988–2009
92Inventor score
Technology areasH10W
Top patents by PatentIndex Score
9 records- 0197US5612570AChip stack and method of making sameDENSE PAC MICROSYSTEMS INC·Filed 1995·Granted Mar 18, 1997·341 cites·18 claims
- 0297US4956694AIntegrated circuit chip stackingDENSE PAC MICROSYSTEMS INC·Filed 1988·Granted Sep 11, 1990·398 cites·25 claims
- 0395US6014316AIC stack utilizing BGA contactsIRVINE SENSORS CORP·Filed 1998·Granted Jan 11, 2000·237 cites·12 claims
- 0494US6028352AIC stack utilizing secondary leadframesIRVINE SENSORS CORP·Filed 1998·Granted Feb 22, 2000·227 cites·9 claims
- 0594US5313096AIC chip package having chip attached to and wire bonded within an overlying substrateDENSE PAC MICROSYSTEMS INC·Filed 1992·Granted May 17, 1994·217 cites·19 claims
- 0684US7242082B2Stackable layer containing ball grid array packageIRVINE SENSORS CORP·Filed 2005·Granted Jul 10, 2007·12 cites·4 claims
- 0779US6195268B1Stacking layers containing enclosed IC chipsFiled 1998·Granted Feb 27, 2001·66 cites·9 claims
- 0871US6967411B2Stackable layers containing ball grid array packagesIRVINE SENSORS CORP·Filed 2003·Granted Nov 22, 2005·18 cites·10 claims
- 0947USRE43536EStackable layer containing ball grid array packageEIDE FLOYD·Filed 2009·Granted Jul 24, 2012·0 cites·35 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →