Inventor · disambiguated record
Flavio Griggio
Also filed as: GRIGGIO FLAVIO
12 granted patents·5 pending applications·8 citations·filing 2014–2024
84Inventor score
Top patents by PatentIndex Score
17 records- 0184US10468298B2Decoupled via fillINTEL CORP·Filed 2019·Granted Nov 5, 2019·3 cites·20 claims
- 0281US10026649B2Decoupled via fillINTEL CORP·Filed 2014·Granted Jul 17, 2018·4 cites·20 claims
- 0375US12108688B2Forming semiconductor-superconductor hybrid devices with a horizontally-confined channelMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2023·Granted Oct 1, 2024·0 cites·20 claims
- 0467US11018054B2Integrated circuit interconnectsINTEL CORP·Filed 2017·Granted May 25, 2021·1 cites·19 claims
- 0566US11849639B2Forming semiconductor-superconductor hybrid devices with a horizontally-confined channelMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2021·Granted Dec 19, 2023·0 cites·20 claims
- 0663US12457911B2Semiconductor-superconductor hybrid devices with a horizontally-confined channel and methods of forming the sameMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2021·Granted Oct 28, 2025·0 cites·19 claims
- 0761US10903114B2Decoupled via fillINTEL CORP·Filed 2019·Granted Jan 26, 2021·0 cites·20 claims
- 0857US10211098B2Decoupled via fillINTEL CORP·Filed 2018·Granted Feb 19, 2019·0 cites·20 claims
- 0957US2025342986A1High-temperature superconductor (hts)-based flexible cabling systems for interconnecting components in two different cryogenic temperature zonesMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2024·Application pending·0 cites
- 1054US2022157735A1Copper interconnect claddingINTEL CORP·Filed 2022·Application pending·0 cites
- 1152US2022328747A1Temperature sensing of regions within a superconducting integrated circuit using in-situ resonatorsMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2021·Application pending·0 cites
- 1246US2022344240A1Multilayer superconducting structures for cryogenic electronicsMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2021·Application pending·0 cites
- 1345US11270943B2Copper interconnect claddingINTEL CORP·Filed 2018·Granted Mar 8, 2022·0 cites·16 claims
- 1445US11094587B2Use of noble metals in the formation of conductive connectorsINTEL CORP·Filed 2015·Granted Aug 17, 2021·0 cites·7 claims
- 1540US11749560B2Cladded metal interconnectsINTEL CORP·Filed 2018·Granted Sep 5, 2023·0 cites·19 claims
- 1637US11652067B2Methods of forming substrate interconnect structures for enhanced thin seed conductionINTEL CORP·Filed 2016·Granted May 16, 2023·0 cites·14 claims
- 1732US2018130707A1Bottom-up fill (buf) of metal features for semiconductor structuresINTEL CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →