Inventor · disambiguated record
Florian Gstrein
Also filed as: GSTREIN FLORIAN
70 granted patents·31 pending applications·340 citations·filing 2005–2025
98Inventor score
Top patents by PatentIndex Score
101 records- 0197US9236292B2Selective area deposition of metal films by atomic layer deposition (ALD) and chemical vapor deposition (CVD)ROMERO PATRICIO E·Filed 2013·Granted Jan 12, 2016·125 cites·9 claims
- 0296US10892223B2Advanced lithography and self-assembled devicesINTEL CORP·Filed 2016·Granted Jan 12, 2021·11 cites·25 claims
- 0396US9793163B2Subtractive self-aligned via and plug patterning for back end of line (BEOL) interconnectsINTEL CORP·Filed 2013·Granted Oct 17, 2017·28 cites·11 claims
- 0495US12218052B2Advanced lithography and self-assembled devicesINTEL CORP·Filed 2023·Granted Feb 4, 2025·1 cites·20 claims
- 0595US9514983B2Cobalt based interconnects and methods of fabrication thereofJEZEWSKI CHRISTOPHER J·Filed 2012·Granted Dec 6, 2016·32 cites·19 claims
- 0692US7635503B2Composite metal films and carbon nanotube fabricationINTEL CORP·Filed 2006·Granted Dec 22, 2009·16 cites·15 claims
- 0791US11854787B2Advanced lithography and self-assembled devicesINTEL CORP·Filed 2022·Granted Dec 26, 2023·1 cites·19 claims
- 0891US9111939B2Metallization of fluorocarbon-based dielectric for interconnectsGSTREIN FLORIAN·Filed 2012·Granted Aug 18, 2015·17 cites·11 claims
- 0990US9932671B2Precursor and process design for photo-assisted metal atomic layer deposition (ALD) and chemical vapor deposition (CVD)INTEL CORP·Filed 2014·Granted Apr 3, 2018·10 cites·8 claims
- 1090US9583389B2Selective area deposition of metal films by atomic layer deposition (ALD) and chemical vapor deposition (CVD)ROMERO PATRICIO E·Filed 2015·Granted Feb 28, 2017·7 cites·11 claims
- 1189US9899255B2Via blocking layerINTEL CORP·Filed 2014·Granted Feb 20, 2018·8 cites·25 claims
- 1289US7208327B2Metal oxide sensors and method of formingINTEL CORP·Filed 2005·Granted Apr 24, 2007·14 cites·13 claims
- 1388US12000189B2Hinge assemblyBLUM GMBH JULIUS·Filed 2022·Granted Jun 4, 2024·2 cites·24 claims
- 1488US11988030B2Hinge assemblyBLUM GMBH JULIUS·Filed 2022·Granted May 21, 2024·2 cites·27 claims
- 1588US9530733B2Forming layers of materials over small regions by selective chemical reaction including limiting enchroachment of the layers over adjacent regionsINTEL CORP·Filed 2013·Granted Dec 27, 2016·8 cites·20 claims
- 1688US8278121B2Method and apparatus to fabricate polymer arrays on patterned wafers using electrochemical synthesisDUBIN VALERY M·Filed 2011·Granted Oct 2, 2012·5 cites·26 claims
- 1788US2025125260A1Advanced lithography and self-assembled devicesINTEL CORP·Filed 2024·Application pending·0 cites
- 1886US10497613B2Microelectronic conductive routes and methods of making the sameINTEL CORP·Filed 2015·Granted Dec 3, 2019·5 cites·14 claims
- 1985US11373950B2Advanced lithography and self-assembled devicesINTEL CORP·Filed 2020·Granted Jun 28, 2022·1 cites·19 claims
- 2085US11320734B2Ligand-capped main group nanoparticles as high absorption extreme ultraviolet lithography resistsINTEL CORP·Filed 2016·Granted May 3, 2022·2 cites·16 claims
- 2185US8975138B2Method of creating a maskless air gap in back end interconnects with double self-aligned viasCHANDHOK MANISH·Filed 2013·Granted Mar 10, 2015·9 cites·14 claims
- 2284US11869889B2Self-aligned gate endcap (SAGE) architectures without fin end gapINTEL CORP·Filed 2019·Granted Jan 9, 2024·4 cites·22 claims
- 2383US9754778B2Metallization of fluorocarbon-based dielectric for interconnectsINTEL CORP·Filed 2015·Granted Sep 5, 2017·3 cites·10 claims
- 2482US8053774B2Method and apparatus to fabricate polymer arrays on patterned wafers using electrochemical synthesisINTEL CORP·Filed 2005·Granted Nov 8, 2011·5 cites·34 claims
- 2581US12506032B2Self-assembled guided hole and via patterning over gratingINTEL CORP·Filed 2024·Granted Dec 23, 2025·0 cites·20 claims
- 2680US10396176B2Selective gate spacers for semiconductor devicesINTEL CORP·Filed 2014·Granted Aug 27, 2019·3 cites·23 claims
- 2780US10243080B2Selective deposition utilizing sacrificial blocking layers for semiconductor devicesINTEL CORP·Filed 2014·Granted Mar 26, 2019·3 cites·20 claims
- 2879US10109583B2Method for creating alternate hardmask cap interconnect structure with increased overlay marginINTEL CORP·Filed 2014·Granted Oct 23, 2018·4 cites·25 claims
- 2978US11137681B2Lined photobucket structure for back end of line (BEOL) interconnect formationINTEL CORP·Filed 2016·Granted Oct 5, 2021·2 cites·19 claims
- 3077US11874600B2Ligand-capped main group nanoparticles as high absorption extreme ultraviolet lithography resistsINTEL CORP·Filed 2022·Granted Jan 16, 2024·0 cites·14 claims
- 3177US11315798B2Two-stage bake photoresist with releasable quencherINTEL CORP·Filed 2016·Granted Apr 26, 2022·2 cites·11 claims
- 3277US10971600B2Selective gate spacers for semiconductor devicesINTEL CORP·Filed 2019·Granted Apr 6, 2021·1 cites·16 claims
- 3377US2024360264A1Chemical compositions & methods of patterning microelectronic device structuresINTEL CORP·Filed 2024·Application pending·0 cites
- 3473US12080639B2Contact over active gate structures with metal oxide layers to inhibit shortingINTEL CORP·Filed 2019·Granted Sep 3, 2024·1 cites·17 claims
- 3573US11862463B2Metal oxide nanoparticles as fillable hardmask materialsINTEL CORP·Filed 2021·Granted Jan 2, 2024·0 cites·8 claims
- 3673US9085461B2Method and apparatus to fabricate polymer arrays on patterned wafers using electrochemical synthesisDUBIN VALERY M·Filed 2012·Granted Jul 21, 2015·1 cites·17 claims
- 3772US12087836B2Contact over active gate structures with metal oxide-caped contacts to inhibit shortingINTEL CORP·Filed 2023·Granted Sep 10, 2024·0 cites·20 claims
- 3872US11532724B2Selective gate spacers for semiconductor devicesINTEL CORP·Filed 2021·Granted Dec 20, 2022·0 cites·20 claims
- 3972US7625817B2Method of fabricating a carbon nanotube interconnect structuresINTEL CORP·Filed 2005·Granted Dec 1, 2009·4 cites·2 claims
- 4071US12341061B2Bottom-up fill dielectric materials for semiconductor structure fabrication and their methods of fabricationINTEL CORP·Filed 2021·Granted Jun 24, 2025·0 cites·20 claims
- 4171US12230536B1Self-assembled guided hole and via patterning over gratingINTEL CORP·Filed 2021·Granted Feb 18, 2025·0 cites·20 claims
- 4271US12037434B2Chemical compositions and methods of patterning microelectronic device structuresINTEL CORP·Filed 2021·Granted Jul 16, 2024·0 cites·6 claims
- 4371US11953826B2Lined photobucket structure for back end of line (BEOL) interconnect formationINTEL CORP·Filed 2021·Granted Apr 9, 2024·0 cites·20 claims
- 4470US11955343B2Two-stage bake photoresist with releasable quencherINTEL CORP·Filed 2022·Granted Apr 9, 2024·0 cites·9 claims
- 4570US11232980B2Bottom-up fill dielectric materials for semiconductor structure fabrication and their methods of fabricationINTEL CORP·Filed 2016·Granted Jan 25, 2022·1 cites·6 claims
- 4669US2023307298A1Aligned pitch-quartered patterning for lithography edge placement error advanced rectificationINTEL CORP·Filed 2023·Application pending·0 cites
- 4768US2024088143A1Self-aligned gate endcap (sage) architectures without fin end gapINTEL CORP·Filed 2023·Application pending·0 cites
- 4867US12012473B2Directed self-assembly structures and techniquesINTEL CORP·Filed 2020·Granted Jun 18, 2024·0 cites·20 claims
- 4966US12266527B1Directed self-assembly enabled patterning over metal layers using assisting featuresINTEL CORP·Filed 2021·Granted Apr 1, 2025·0 cites·20 claims
- 5064US12400913B2Contact over active gate structures with conductive trench contact taps for advanced integrated circuit structure fabricationINTEL CORP·Filed 2021·Granted Aug 26, 2025·0 cites·20 claims
Showing the top 50 of 101 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →