Inventor · disambiguated record
Florian G. Herrault
Also filed as: HERRAULT FLORIAN · HERRAULT FLORIAN G
42 granted patents·7 pending applications·237 citations·filing 2014–2025
97Inventor score
Top patents by PatentIndex Score
49 records- 0198US11158520B2Method to protect die during metal-embedded chip assembly (MECA) processHRL LAB LLC·Filed 2020·Granted Oct 26, 2021·8 cites·16 claims
- 0298US9385083B1Wafer-level die to package and die to die interconnects suspended over integrated heat sinksHRL LAB LLC·Filed 2015·Granted Jul 5, 2016·52 cites·14 claims
- 0397US10026672B1Recursive metal embedded chip assemblyHRL LAB LLC·Filed 2016·Granted Jul 17, 2018·19 cites·32 claims
- 0496US10483184B1Recursive metal embedded chip assemblyHRL LAB LLC·Filed 2018·Granted Nov 19, 2019·13 cites·34 claims
- 0596US9837372B1Wafer-level die to package and die to die interconnects suspended over integrated heat sinksHRL LAB LLC·Filed 2016·Granted Dec 5, 2017·16 cites·18 claims
- 0696US9508652B1Direct IC-to-package wafer level packaging with integrated thermal heat spreadersHRL LAB LLC·Filed 2015·Granted Nov 29, 2016·25 cites·20 claims
- 0796US9337124B1Method of integration of wafer level heat spreaders and backside interconnects on microelectronics wafersHRL LAB LLC·Filed 2014·Granted May 10, 2016·34 cites·33 claims
- 0895US10957537B2Methods to design and uniformly co-fabricate small vias and large cavities through a substrateHRL LAB LLC·Filed 2019·Granted Mar 23, 2021·12 cites·27 claims
- 0995US10600739B1Interposer with interconnects and methods of manufacturing the sameHRL LAB LLC·Filed 2018·Granted Mar 24, 2020·16 cites·21 claims
- 1093US11756848B1Chip integration into cavities of a host wafer using lateral dielectric material bondingPSEUDOLITHIC INC·Filed 2023·Granted Sep 12, 2023·3 cites·13 claims
- 1193US10998273B2Hybrid integrated circuit architectureHRL LAB LLC·Filed 2018·Granted May 4, 2021·14 cites·19 claims
- 1292US11810876B1Heterogeneous integration of radio frequency transistor chiplets having interconnection tuning circuitsPSEUDOLITHIC INC·Filed 2023·Granted Nov 7, 2023·2 cites·20 claims
- 1391US11769843B1Photonic integrated module with metal embedded chipsHRL LAB LLC·Filed 2020·Granted Sep 26, 2023·3 cites·17 claims
- 1490US9842814B1Integrated RF subsystemHRL LAB LLC·Filed 2016·Granted Dec 12, 2017·7 cites·23 claims
- 1588US11219919B1Electrostatically driven assembly of nanoparticle materials into dense filmsHRL LAB LLC·Filed 2017·Granted Jan 11, 2022·3 cites·14 claims
- 1688US9825116B1Formation of high-resolution patterns inside deep cavities and applications to RF SI-embedded inductorsHRL LAB LLC·Filed 2015·Granted Nov 21, 2017·5 cites·14 claims
- 1787US11733297B1Built in self-test of heterogeneous integrated radio frequency chipletsPSEUDOLITHIC INC·Filed 2023·Granted Aug 22, 2023·1 cites·21 claims
- 1882US12191295B1Heterogeneous integration of radio frequency transistor chiplets having interconnections to host wafer circuits for optimizing operating conditionsPSEUDOLITHIC INC·Filed 2024·Granted Jan 7, 2025·0 cites·24 claims
- 1981US11295882B1Magnetically anisotropic binder-free films containing discrete hexaferrite nanoplateletsHRL LAB LLC·Filed 2019·Granted Apr 5, 2022·1 cites·25 claims
- 2080US2025391826A1Heterogeneous integration of radio frequency transistor chiplets having interconnections to wafer circuits for optimizing operating conditionsPSEUDOLITHIC INC·Filed 2025·Application pending·0 cites
- 2178US10847857B2Method and apparatus for integrated shielded circulatorHRL LAB LLC·Filed 2019·Granted Nov 24, 2020·2 cites·15 claims
- 2277US12272475B2Magnetically anisotropic binder-free films containing discrete hexaferrite nanoplateletsHRL LAB LLC·Filed 2022·Granted Apr 8, 2025·0 cites·39 claims
- 2377US12261091B2Chip integration into cavities of a host wafer using lateral dielectric material bondingPSEUDOLITHIC INC·Filed 2023·Granted Mar 25, 2025·0 cites·24 claims
- 2477US12125759B2Chip integration into cavities of a host wafer using lateral dielectric material bondingPSEUDOLITHIC INC·Filed 2023·Granted Oct 22, 2024·0 cites·20 claims
- 2577US12099092B1Built in self-test of heterogeneous integrated radio frequency chipletsPSEUDOLITHIC INC·Filed 2023·Granted Sep 24, 2024·0 cites·21 claims
- 2676US11940495B1Built in self-test of heterogeneous integrated radio frequency chipletsPSEUDOLITHIC INC·Filed 2023·Granted Mar 26, 2024·0 cites·21 claims
- 2776US2025218882A1Chip integration into cavities of a host wafer using lateral dielectric material bondingPSEUDOLITHIC INC·Filed 2025·Application pending·0 cites
- 2871US12322714B2Heterogeneous integration of radio frequency transistor chiplets having interconnection tuning circuitsPSEUDOLITHIC INC·Filed 2023·Granted Jun 3, 2025·0 cites·18 claims
- 2971US2025285997A1Heterogeneous integration of radio frequency transistor chiplets having interconnection tuning circuitsPSEUDOLITHIC INC·Filed 2025·Application pending·0 cites
- 3069US2025391824A1Heterogeneous integration of radio frequency transistor chiplets having interconnections to host wafer circuits for optimizing operating conditionsPSEUDOLITHIC INC·Filed 2025·Application pending·0 cites
- 3167US10062505B1Laminated conductorsHRL LAB LLC·Filed 2015·Granted Aug 28, 2018·1 cites·12 claims
- 3266US11434171B1Low-temperature-deposited self-biased magnetic composite films containing discrete hexaferrite plateletsHRL LAB LLC·Filed 2020·Granted Sep 6, 2022·0 cites·27 claims
- 3366US10388454B1Laminated conductorsHRL LAB LLC·Filed 2018·Granted Aug 20, 2019·0 cites·11 claims
- 3463US11536800B2Method and apparatus to increase radar rangeHRL LAB LLC·Filed 2021·Granted Dec 27, 2022·0 cites·20 claims
- 3563US11300754B2Offset patterned micro-lens and micro-optical bench including the sameHRL LAB LLC·Filed 2020·Granted Apr 12, 2022·0 cites·18 claims
- 3660US2024304508A1Multi-thickness chip integration into cavities of a host wafer using lateral dielectric materialPSEUDOLITHIC INC·Filed 2024·Application pending·0 cites
- 3758US12230659B1Interposer for curved detectorHRL LAB LLC·Filed 2021·Granted Feb 18, 2025·0 cites·9 claims
- 3857US12218067B1Through-wafer coaxial transitionHRL LAB LLC·Filed 2021·Granted Feb 4, 2025·0 cites·9 claims
- 3957US10032851B1Formation of high-resolution patterns inside deep cavities and applications to RF Si-embedded inductorsHRL LAB LLC·Filed 2017·Granted Jul 24, 2018·0 cites·4 claims
- 4056US12463109B2Thermal isolation between embedded MECA modulesHRL LAB LLC·Filed 2022·Granted Nov 4, 2025·0 cites·23 claims
- 4156US11721605B2Wafer-level integrated micro-structured heat spreadersHRL LAB LLC·Filed 2021·Granted Aug 8, 2023·0 cites·24 claims
- 4255US11527482B2Hybrid integrated circuit architectureHRL LAB LLC·Filed 2021·Granted Dec 13, 2022·0 cites·20 claims
- 4355US2024203798A1End-Point Detection for Backside Metal Thickness ControlHRL LAB LLC·Filed 2022·Application pending·0 cites
- 4454US11972970B1Singulation process for chipletsHRL LAB LLC·Filed 2021·Granted Apr 30, 2024·0 cites·6 claims
- 4554US10829386B1Methods for making hydrothermally crystallized water-dispersible hexaferrite plateletsHRL LAB LLC·Filed 2018·Granted Nov 10, 2020·0 cites·24 claims
- 4652US10950562B1Impedance-matched through-wafer transition using integrated heat-spreader technologyHRL LAB LLC·Filed 2019·Granted Mar 16, 2021·0 cites·20 claims
- 4749US11756783B1Method for creating cavities in silicon carbide and other semiconductor substratesHRL LAB LLC·Filed 2021·Granted Sep 12, 2023·0 cites·24 claims
- 4843US11029387B2Radar system with frequency conversion and corresponding methodGM GLOBAL TECH OPERATIONS LLC·Filed 2018·Granted Jun 8, 2021·0 cites·16 claims
- 4936US2019237400A1Integrated circuit with metallic interlocking structureHRL LAB LLC·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →