Inventor · disambiguated record
Ford B. Grigg
Also filed as: GRIGG FORD · GRIGG FORD B
60 granted patents·11 pending applications·2,322 citations·filing 1997–2011
99Inventor score
Top patents by PatentIndex Score
71 records- 0198US6506681B2Thin flip—chip methodMICRON TECHNOLOGY INC·Filed 2000·Granted Jan 14, 2003·197 cites·84 claims
- 0298US6150717ADirect die contact (DDC) semiconductor packageMICRON TECHNOLOGY INC·Filed 1998·Granted Nov 21, 2000·296 cites·19 claims
- 0398US6107122ADirect die contact (DDC) semiconductor packageMICRON TECHNOLOGY INC·Filed 1997·Granted Aug 22, 2000·286 cites·20 claims
- 0497US6630730B2Semiconductor device assemblies including interposers with dams protruding therefromMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 7, 2003·189 cites·38 claims
- 0597US6585927B2Methods for labeling semiconductor device componentsMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 1, 2003·76 cites·31 claims
- 0697US6337122B1Stereolithographically marked semiconductors devices and methodsMICRON TECHNOLOGY INC·Filed 2000·Granted Jan 8, 2002·121 cites·22 claims
- 0796US6635333B2Stereolithographically marked semiconductor devices and methodsMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 21, 2003·62 cites·22 claims
- 0896US6622380B1Methods for manufacturing microelectronic devices and methods for mounting microelectronic packages to circuit boardsMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 23, 2003·105 cites·37 claims
- 0994US6984545B2Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder maskMICRON TECHNOLOGY INC·Filed 2002·Granted Jan 10, 2006·72 cites·28 claims
- 1094US6489007B2Stereolithographically marked semiconductor devices and methodsMICRON TECHNOLOGY INC·Filed 2000·Granted Dec 3, 2002·46 cites·18 claims
- 1193US5840598ALOC semiconductor assembled with room temperature adhesiveMICRON TECHNOLOGY INC·Filed 1997·Granted Nov 24, 1998·53 cites·9 claims
- 1292US7811903B2Thin flip-chip methodMICRON TECHNOLOGY INC·Filed 2007·Granted Oct 12, 2010·18 cites·19 claims
- 1392US7125748B2Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder maskMICRON TECHNOLOGY INC·Filed 2005·Granted Oct 24, 2006·21 cites·33 claims
- 1491US7291543B2Thin flip-chip methodMICRON TECHNOLOGY INC·Filed 2005·Granted Nov 6, 2007·17 cites·35 claims
- 1591US6562661B2Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating sameMICRON TECHNOLOGY INC·Filed 2001·Granted May 13, 2003·36 cites·12 claims
- 1689US7557452B1Reinforced, self-aligning conductive structures for semiconductor device components and methods for fabricating sameMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 7, 2009·43 cites·129 claims
- 1789US6531335B1Interposers including upwardly protruding dams, semiconductor device assemblies including the interposers, and methodsMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 11, 2003·93 cites·47 claims
- 1889US5959347ALOC semiconductor assembled with room temperature adhesiveMICRON TECHNOLOGY INC·Filed 1998·Granted Sep 28, 1999·36 cites·14 claims
- 1987US6905946B2Thin flip-chip methodMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 14, 2005·33 cites·84 claims
- 2086US6746899B2Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating sameMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 8, 2004·24 cites·17 claims
- 2186US6740962B1Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating sameMICRON TECHNOLOGY INC·Filed 2000·Granted May 25, 2004·25 cites·65 claims
- 2286US6703105B2Stereolithographically marked semiconductor devices and methodsMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 9, 2004·19 cites·15 claims
- 2386US6427587B1Method and stencil for extruding material on a substrateMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 6, 2002·8 cites·17 claims
- 2485US8062958B2Microelectronic device wafers and methods of manufacturingWOOD ALAN G·Filed 2009·Granted Nov 22, 2011·8 cites·26 claims
- 2585US6939501B2Methods for labeling semiconductor device componentsMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 6, 2005·17 cites·26 claims
- 2685US6584897B2Method and stencil for extruding material on a substrateMICRON TECHNOLOGY INC·Filed 2002·Granted Jul 1, 2003·21 cites·11 claims
- 2783US6706374B2Stereolithographically marked semiconductor devices and methodsMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 16, 2004·15 cites·15 claims
- 2883US6506671B1Ring positionable about a periphery of a contact pad, semiconductor device components including same, and methods for positioning the ring around a contact padMICRON TECHNOLOGY INC·Filed 2000·Granted Jan 14, 2003·57 cites·44 claims
- 2982US6089151AMethod and stencil for extruding material on a substrateMICRON TECHNOLOGY INC·Filed 1998·Granted Jul 18, 2000·31 cites·19 claims
- 3081US6269742B1Method and stencil for extruding material on a substrateMICRON TECHNOLOGY INC·Filed 2000·Granted Aug 7, 2001·8 cites·19 claims
- 3180US6548897B2Ring positionable about a periphery of a contact pad, semiconductor device components including same, and methods for positioning the ring around a contact padMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 15, 2003·48 cites·14 claims
- 3275US7122905B2Microelectronic devices and methods for mounting microelectronic packages to circuit boardsMICRON TECHNOLOGY INC·Filed 2003·Granted Oct 17, 2006·19 cites·8 claims
- 3373US6372624B1Method for fabricating solder bumps by wave solderingMICRON TECHNOLOGY INC·Filed 1997·Granted Apr 16, 2002·37 cites·20 claims
- 3472US7170171B2Support ring for use with a contact pad and semiconductor device components including the sameMICRON TECHNOLOGY INC·Filed 2005·Granted Jan 30, 2007·13 cites·20 claims
- 3572US6602430B1Methods for finishing microelectronic device packagesMICRON TECHNOLOGY INC·Filed 2000·Granted Aug 5, 2003·20 cites·41 claims
- 3671US6854633B1System with polymer masking flux for fabricating external contacts on semiconductor componentsMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 15, 2005·16 cites·31 claims
- 3769US7138724B2Thick solder mask for confining encapsulant material over selected locations of a substrate and assemblies including the solder maskMICRON TECHNOLOGY INC·Filed 2003·Granted Nov 21, 2006·11 cites·17 claims
- 3864US6248611B1LOC semiconductor assembled with room temperature adhesiveMICRON TECHNOLOGY INC·Filed 1998·Granted Jun 19, 2001·11 cites·10 claims
- 3963US7109106B2Methods for providing support for conductive structures protruding from semiconductor device componentsMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 19, 2006·5 cites·34 claims
- 4061US6902995B2Ring positionable about a periphery of a contact pad, semiconductor device components including same, and methods for positioning the ring around a contact padMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 7, 2005·16 cites·43 claims
- 4160US6882049B2Support ring for use with a contact pad and semiconductor device components including the sameMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 19, 2005·15 cites·20 claims
- 4260US2005268801A1Method and stencil for extruding material on a substrateCOBBLEY CHAD·Filed 2005·Application pending·0 cites
- 4359US7134390B2Method and stencil for extruding material on a substrateMICRON TECHNOLOGY INC·Filed 2003·Granted Nov 14, 2006·4 cites·11 claims
- 4459US7029954B2Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating sameMICRON TECHNOLOGY INC·Filed 2004·Granted Apr 18, 2006·4 cites·22 claims
- 4559US6787396B2Method of manufacturing LOC semiconductor assembled with room temperature adhesiveMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 7, 2004·3 cites·10 claims
- 4659US6534342B2Method of manufacturing LOC semiconductor assembled with room temperature adhesiveMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 18, 2003·3 cites·10 claims
- 4759US6337511B1LOC semiconductor assembled with room temperature adhesiveMICRON TECHNOLOGY INC·Filed 2000·Granted Jan 8, 2002·3 cites·12 claims
- 4857US6637638B1System for fabricating solder bumps on semiconductor componentsMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 28, 2003·6 cites·25 claims
- 4956US7115981B2Semiconductor device assemblies including interposers with dams protruding therefromMICRON TECHNOLOGY INC·Filed 2003·Granted Oct 3, 2006·12 cites·22 claims
- 5054US7041532B2Methods for fabricating interposers including upwardly protruding damsMICRON TECHNOLOGY INC·Filed 2004·Granted May 9, 2006·10 cites·22 claims
Showing the top 50 of 71 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →