Inventor · disambiguated record
Fong Mei Lum
Also filed as: LUM FONG MEI
3 granted patents·1 pending application·4 citations·filing 2016–2021
58Inventor score
Technology areasH10W
Files withINFINEON TECHNOLOGIES AG4
Top patents by PatentIndex Score
4 records- 0174US10431560B2Molded semiconductor package having an optical inspection featureINFINEON TECHNOLOGIES AG·Filed 2017·Granted Oct 1, 2019·2 cites·21 claims
- 0272US9806043B2Method of manufacturing molded semiconductor packages having an optical inspection featureINFINEON TECHNOLOGIES AG·Filed 2016·Granted Oct 31, 2017·2 cites·13 claims
- 0354US11682644B2Semiconductor device with a heterogeneous solder joint and method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jun 20, 2023·0 cites·16 claims
- 0452US2020006267A1Molded Semiconductor PackageINFINEON TECHNOLOGIES AG·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →