Inventor · disambiguated record
Frederick Arellano
Also filed as: ARELLANO FREDERICK
4 granted patents·2 pending applications·4 citations·filing 2015–2025
61Inventor score
Technology areasH10W
Files withST MICROELECTRONICS INC6
Top patents by PatentIndex Score
6 records- 0183US2025343119A1Bottom package exposed die mems pressure sensor integrated circuit package designST MICROELECTRONICS INC·Filed 2025·Application pending·0 cites
- 0274US9824979B2Electronic package having electromagnetic interference shielding and associated methodST MICROELECTRONICS INC·Filed 2015·Granted Nov 21, 2017·4 cites·20 claims
- 0358US11355423B2Bottom package exposed die MEMS pressure sensor integrated circuit package designST MICROELECTRONICS INC·Filed 2019·Granted Jun 7, 2022·0 cites·20 claims
- 0449US10483191B2Bottom package exposed die MEMS pressure sensor integrated circuit package designST MICROELECTRONICS INC·Filed 2016·Granted Nov 19, 2019·0 cites·18 claims
- 0538US9761538B1Method for making a shielded integrated circuit (IC) package with an electrically conductive polymer layerST MICROELECTRONICS INC·Filed 2016·Granted Sep 12, 2017·0 cites·30 claims
- 0628US2017084490A1Method for making ic with stepped sidewall and related ic devicesST MICROELECTRONICS INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →