Inventor · disambiguated record
Frank Balma
Also filed as: BALMA FRANK · BALMA FRANK R
22 granted patents·6 pending applications·281 citations·filing 1991–2022
94Inventor score
Files withCOMPONENT RE ENG COMPANY INC9COMPONENT RE ENGINEERING COMPANY INC5WATLOW ELECTRIC MFG5COMPONENT RE ENGINEERING COMPA2ELLIOT BRENT2
Top patents by PatentIndex Score
28 records- 0194US5605179AIntegrated gas panelINSYNC SYSTEMS INC·Filed 1995·Granted Feb 25, 1997·209 cites·3 claims
- 0289US11712745B2Semiconductor substrate support with multiple electrodes and method for making sameWATLOW ELECTRIC MFG·Filed 2022·Granted Aug 1, 2023·1 cites·14 claims
- 0387US8684256B2Method for hermetically joining plate and shaft devices including ceramic materials used in semiconductor processingCOMPONENT RE ENGINEERING COMPANY INC·Filed 2012·Granted Apr 1, 2014·7 cites·10 claims
- 0487US7098428B1System and method for an improved susceptorELLIOT BRENT·Filed 2005·Granted Aug 29, 2006·20 cites·20 claims
- 0586US9624137B2Low temperature method for hermetically joining non-diffusing ceramic materialsCOMPONENT RE-ENGINEERING COMPANY INC·Filed 2014·Granted Apr 18, 2017·6 cites·26 claims
- 0686US8789743B2Hermetically joined ceramic assemblies and low temperature method for hermetically joining ceramic materialsCOMPONENT RE ENGINEERING COMPANY INC·Filed 2012·Granted Jul 29, 2014·5 cites·19 claims
- 0782US11091397B2Low temperature method for hermetically joining non-diffusing ceramic materials in multi-layer plate devicesWATLOW ELECTRIC MFG·Filed 2019·Granted Aug 17, 2021·2 cites·20 claims
- 0877US8932690B2Plate and shaft deviceELLIOT ALFRED GRANT·Filed 2012·Granted Jan 13, 2015·4 cites·13 claims
- 0974US10646941B2Method for manufacture of a multi-layer plate deviceCOMPONENT RE ENG COMPANY INC·Filed 2017·Granted May 12, 2020·1 cites·16 claims
- 1070US9984866B2Multiple zone heaterCOMPONENT RE ENG COMPANY INC·Filed 2013·Granted May 29, 2018·2 cites·7 claims
- 1169US10593584B2Electrostatic chuck for clamping in high temperature semiconductor processing and method of making sameCOMPONENT RE ENG COMPANY INC·Filed 2016·Granted Mar 17, 2020·1 cites·27 claims
- 1269US9556074B2Method for manufacture of a multi-layer plate deviceCOMPONENT RE-ENGINEERING COMPANY INC·Filed 2012·Granted Jan 31, 2017·1 cites·23 claims
- 1369US9315424B2Multi-layer plate deviceCOMPONENT RE ENGINEERING COMPANY INC·Filed 2012·Granted Apr 19, 2016·1 cites·19 claims
- 1467US10153183B2High speed low temperature method for manufacturing and repairing semiconductor processing equipment and equipment produced using sameCOMPONENT RE ENG COMPANY INC·Filed 2014·Granted Dec 11, 2018·1 cites·10 claims
- 1561US11222804B2Electrostatic chuck for clamping in high temperature semiconductor processing and method of making sameWATLOW ELECTRIC MFG·Filed 2020·Granted Jan 11, 2022·0 cites·20 claims
- 1661US10991616B2High speed low temperature method for manufacturing and repairing semiconductor processing equipment and equipment produced using sameCOMPONENT RE ENG COMPANY INC·Filed 2018·Granted Apr 27, 2021·0 cites·7 claims
- 1757US11823890B2Multiple zone heaterWATLOW ELECTRIC MFG·Filed 2022·Granted Nov 21, 2023·0 cites·20 claims
- 1857US10213858B2Multi-layer plate deviceCOMPONENT RE ENG COMPANY INC·Filed 2016·Granted Feb 26, 2019·0 cites·15 claims
- 1956US5178651AMethod for purifying gas distribution systemsBALMA FRANK R·Filed 1991·Granted Jan 12, 1993·20 cites·3 claims
- 2055US10287215B2Low temperature method for hermetically joining non-diffusing ceramic materials in multi-layer plate devicesCOMPONENT RE ENG COMPANY INC·Filed 2017·Granted May 14, 2019·0 cites·14 claims
- 2154US11495450B2Multiple zone heaterWATLOW ELECTRIC MFG·Filed 2018·Granted Nov 8, 2022·0 cites·16 claims
- 2248US9999947B2Method for repairing heaters and chucks used in semiconductor processingCOMPONENT RE ENG COMPANY INC·Filed 2016·Granted Jun 19, 2018·0 cites·22 claims
- 2348US2019366459A1Method for repairing heaters and chucks used in semiconductor processingCOMPONENT RE ENG COMPANY INC·Filed 2018·Application pending·0 cites
- 2447US2007169703A1Advanced ceramic heater for substrate processingELLIOT BRENT·Filed 2006·Application pending·0 cites
- 2547US2010177454A1Electrostatic chuck with dielectric insertsCOMPONENT RE ENGINEERING COMPA·Filed 2009·Application pending·0 cites
- 2646US2008314320A1Chamber Mount for High Temperature Application of AIN HeatersCOMPONENT RE ENGINEERING COMPA·Filed 2008·Application pending·0 cites
- 2743US2014014710A1Method For Hermetically Joining Ceramic Materials Using Brazing Of Pre-Metallized RegionsCOMPONENT RE ENGINEERING COMPNAY INC·Filed 2013·Application pending·0 cites
- 2837US2004250774A1Wafer heater with protected heater elementFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →