Inventor · disambiguated record
Frank Fournel
Also filed as: FOURNEL FRANK
44 granted patents·16 pending applications·62 citations·filing 2003–2023
96Inventor score
Files withCOMMISSARIAT ENERGIE ATOMIQUE49COMMISSARIAT L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES2FOURNEL FRANK2AMS AG1BENEYTON REMI1
Top patents by PatentIndex Score
60 records- 0192US7579259B2Simplified method of producing an epitaxially grown structureCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2006·Granted Aug 25, 2009·21 cites·21 claims
- 0288US11715710B2Method of treatment of an electronic circuit for a hybrid molecular bondingCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2021·Granted Aug 1, 2023·2 cites·14 claims
- 0388US11575063B2Method for fabricating a detection device comprising a step of direct bonding of a thin sealing layer provided with a getter materialCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2020·Granted Feb 7, 2023·2 cites·13 claims
- 0488US11346722B2Method for fabricating a detection device comprising a step of transferring and direct bonding of a thin layer provided with a getter materialCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2020·Granted May 31, 2022·2 cites·12 claims
- 0584US11694991B2Method for transferring chipsCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2021·Granted Jul 4, 2023·1 cites·16 claims
- 0680US10438921B2Method for direct bonding with self-alignment using ultrasoundCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2016·Granted Oct 8, 2019·4 cites·12 claims
- 0777US9922954B2Method for performing direct bonding between two structuresCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2016·Granted Mar 20, 2018·2 cites·16 claims
- 0877US8530331B2Process for assembling substrates with low-temperature heat treatmentsBENEYTON REMI·Filed 2011·Granted Sep 10, 2013·3 cites·31 claims
- 0975US9427948B2Manufacturing a flexible structure by transfers of layersCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2012·Granted Aug 30, 2016·4 cites·14 claims
- 1072US11088010B2Temporary bonding method with thermoplastic adhesive incorporating a rigid ringCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2019·Granted Aug 10, 2021·1 cites·9 claims
- 1168US8828244B2Method for building a substrate holderFOURNEL FRANK·Filed 2011·Granted Sep 9, 2014·3 cites·18 claims
- 1266US10497609B2Method for direct bonding of substrates including thinning of the edges of at least one of the two substratesCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2016·Granted Dec 3, 2019·1 cites·10 claims
- 1363US12412786B2Method for transferring a layer from a source substrate to a destination substrateCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2023·Granted Sep 9, 2025·0 cites·11 claims
- 1463US10643884B2Method for manufacturing a semiconductor structure with temporary direct bonding using a porous layerCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2016·Granted May 5, 2020·1 cites·19 claims
- 1562US12424497B2Method for transferring a layer from a source substrate to a destination substrateCOMMISSARIAT A IENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES·Filed 2023·Granted Sep 23, 2025·0 cites·11 claims
- 1658US11569115B2Temporary bonding methodCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2021·Granted Jan 31, 2023·0 cites·12 claims
- 1758US9321636B2Method for producing a substrate holderFOURNEL FRANK·Filed 2012·Granted Apr 26, 2016·1 cites·25 claims
- 1858US7863156B2Method of producing a strained layerCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2009·Granted Jan 4, 2011·1 cites·24 claims
- 1958US7264996B2Method for separating wafers bonded together to form a stacked structureCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2004·Granted Sep 4, 2007·7 cites·11 claims
- 2058US2009162991A1Process for assembling substrates with low-temperature heat treatmentsCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2007·Application pending·0 cites
- 2156US8501026B2Method for making a planar membraneCONSTANCIAS CHRISTOPHE·Filed 2010·Granted Aug 6, 2013·2 cites·13 claims
- 2256US2023377935A1Temporary bonding methodCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2023·Application pending·0 cites
- 2356US2024006231A1Method for manufacturing a paved structureCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2023·Application pending·0 cites
- 2455US12463174B2Method for bonding chips to a substrate by direct bondingCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2020·Granted Nov 4, 2025·0 cites·15 claims
- 2555US11710653B2Method for manufacturing a handle substrate intended for temporary bonding of a substrateCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2021·Granted Jul 25, 2023·0 cites·9 claims
- 2655US2020094538A1Substrate stripping method by transfer of a thermoplastic polymer surface filmCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2019·Application pending·0 cites
- 2754US2023420408A1Self-aligning bonding by hydrophilic contrastCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2023·Application pending·0 cites
- 2854US2023207515A1Method of assembly by direct bonding of electronic componentsCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2022·Application pending·0 cites
- 2953US11081463B2Bonding method with electron-stimulated desorptionCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2019·Granted Aug 3, 2021·0 cites·10 claims
- 3052US7544547B2Method for producing a support for the growth of localised elongated nanostructuresCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2007·Granted Jun 9, 2009·4 cites·21 claims
- 3152US2023386894A1Strong base-assisted direct bonding methodCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2023·Application pending·0 cites
- 3252US2023387070A1Basic molecule-assisted direct bonding methodCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2023·Application pending·0 cites
- 3351US12227679B2Surface activated bonding method by ion or atom bombardment of a first surface of a first substrate to a second surface of a second substrateCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2023·Granted Feb 18, 2025·0 cites·8 claims
- 3451US2024093063A1Method for transferring an adhesive layer of thermoplastic polymer(s) from a first substrate to a second substrateCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2023·Application pending·0 cites
- 3550US12417942B2Process for hydrophilically bonding substratesCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2020·Granted Sep 16, 2025·0 cites·15 claims
- 3650US2015180038A1Bipolar Li-Ion Battery with Improved Seal and Associated Production ProcessCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2013·Application pending·0 cites
- 3748US11562899B2Method for transferring thin layersCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2017·Granted Jan 24, 2023·0 cites·19 claims
- 3848US11335584B2Method of dismantling a stack of at least three substratesCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2020·Granted May 17, 2022·0 cites·24 claims
- 3947US11056340B2Direct bonding processCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2018·Granted Jul 6, 2021·0 cites·14 claims
- 4047US8382933B2Molecular bonding method with cleaning with hydrofluoric acid in vapor phase and rinsing with deionized waterCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2008·Granted Feb 26, 2013·0 cites·11 claims
- 4146US10957539B2Method for bonding by direct adhesionCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2018·Granted Mar 23, 2021·0 cites·15 claims
- 4246US10100400B2Method for recycling a substrate holderCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2013·Granted Oct 16, 2018·0 cites·14 claims
- 4346US2023317510A1Method for bonding a first substrate at a surface having an elastic nanotopologyCOMMISSARIAT A L’ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES·Filed 2023·Application pending·0 cites
- 4444US11482567B2LED emissive display device and method for producing such a deviceCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2019·Granted Oct 25, 2022·0 cites·15 claims
- 4544US10884187B2Method for the collective production of a plurality of optoelectronic chipsCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2017·Granted Jan 5, 2021·0 cites·15 claims
- 4643US9934995B2Method for manufacturing a handle substrate for the temporary bonding of a substrateCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2014·Granted Apr 3, 2018·0 cites·15 claims
- 4743US9779982B2Fabrication method of a stack of electronic devicesCommissariat à l'Energie Atomique et aux Energies Alternatives·Filed 2016·Granted Oct 3, 2017·0 cites·14 claims
- 4843US2015349191A1Method for producing a thick crystalline layerCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2013·Application pending·0 cites
- 4942US12322717B2Semiconductor device and method for manufacturing a semiconductor deviceAMS AG·Filed 2020·Granted Jun 3, 2025·0 cites·17 claims
- 5041US2024113493A1Device for regrowth of a thick structure, photonic device comprising the same and associated methods of fabricationNOKIA SOLUTION AND NETWORKS OY·Filed 2020·Application pending·0 cites
Showing the top 50 of 60 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Frank Fournel files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →