Inventor · disambiguated record
Franck Fournel
Also filed as: FOURNEL FRANCK
26 granted patents·10 pending applications·168 citations·filing 2001–2025
95Inventor score
Files withCOMMISSARIAT ENERGIE ATOMIQUE20FOURNEL FRANCK6COMMISSARIAT A IENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES3SOITEC SILICON ON INSULATOR3SIGNAMARCHEIX THOMAS2
Top patents by PatentIndex Score
36 records- 0184US7781300B2Method for producing mixed stacked structures, different insulating areas and/or localised vertical electrical conducting areasCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2005·Granted Aug 24, 2010·14 cites·74 claims
- 0284US6724017B2Method for automatic organization of microstructures or nanostructures and related device obtainedCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2001·Granted Apr 20, 2004·25 cites·26 claims
- 0383US7494897B2Method of producing mixed substrates and structure thus obtainedCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2003·Granted Feb 24, 2009·29 cites·31 claims
- 0481US8252663B2Method of transferring a thin layer onto a target substrate having a coefficient of thermal expansion different from that of the thin layerFOURNEL FRANCK·Filed 2010·Granted Aug 28, 2012·6 cites·10 claims
- 0576US8445122B2Data storage medium and associated methodDEGUET CHRYSTEL·Filed 2008·Granted May 21, 2013·3 cites·15 claims
- 0672US8318555B2Method of producing a hybrid substrate having a continuous buried electrically insulating layerSIGNAMARCHEIX THOMAS·Filed 2009·Granted Nov 27, 2012·6 cites·13 claims
- 0771US9209068B2Method for the treatment and direct bonding of a material layerCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2012·Granted Dec 8, 2015·3 cites·13 claims
- 0870US6838358B2Method of manufacturing a waferSOITEC SILICON ON INSULATOR·Filed 2003·Granted Jan 4, 2005·17 cites·24 claims
- 0969US12288694B2Method for forming patterns on a substrateCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2024·Granted Apr 29, 2025·0 cites·11 claims
- 1069US8501589B2Method in the microelectronics fields of forming a monocrystalline layerFOURNEL FRANCK·Filed 2009·Granted Aug 6, 2013·3 cites·15 claims
- 1167US12230508B1Substrate structuring methodCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2024·Granted Feb 18, 2025·0 cites·11 claims
- 1264US8309431B2Method for self-supported transfer of a fine layer by pulsation after implantation or co-implantationNGUYEN NGUYET-PHUONG·Filed 2004·Granted Nov 13, 2012·16 cites·31 claims
- 1363US8871607B2Method for producing hybrid componentsSIGNAMARCHEIX THOMAS·Filed 2008·Granted Oct 28, 2014·3 cites·27 claims
- 1463US2025301825A1Method of manufacturing optoelectronic devicesCOMMISSARIAT A IENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES·Filed 2025·Application pending·0 cites
- 1561US7041227B2Method for revealing crystalline defects and/or stress field defects at the molecular adhesion interface of two solid materialsCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2001·Granted May 9, 2006·8 cites·11 claims
- 1660US8207048B2Method for producing ordered nanostructuresFOURNEL FRANCK·Filed 2006·Granted Jun 26, 2012·2 cites·16 claims
- 1760US7550052B2Method of producing a complex structure by assembling stressed structuresCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2003·Granted Jun 23, 2009·8 cites·36 claims
- 1860US7258743B2Composite structure with a uniform crystal orientation and the method of controlling the crystal orientation of one such structureCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2002·Granted Aug 21, 2007·9 cites·11 claims
- 1960US2025210360A1Method for forming hydrophobic zones on a substrateCOMMISSARIAT A IENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES·Filed 2024·Application pending·0 cites
- 2060US2025391698A1Chips direct bonding methodCOMMISSARIAT A IENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES·Filed 2025·Application pending·0 cites
- 2159US2025207242A1Method for producing and transferring a two-dimensional materialCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2024·Application pending·0 cites
- 2257US9824912B2Method of transforming an electronic deviceCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2015·Granted Nov 21, 2017·1 cites·14 claims
- 2357US8841202B2Method of producing a hybrid substrate by partial recrystallization of a mixed layerFOURNEL FRANCK·Filed 2010·Granted Sep 23, 2014·1 cites·15 claims
- 2457US2024326087A1Process for rectifying a polymer filmCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2024·Application pending·0 cites
- 2555US9718261B2Assembly process of two substratesSOITEC SILICON ON INSULATOR·Filed 2015·Granted Aug 1, 2017·1 cites·20 claims
- 2655US8389379B2Method for making a stressed structure designed to be dissociatedFOURNEL FRANCK·Filed 2009·Granted Mar 5, 2013·1 cites·26 claims
- 2755US2025360679A1Method for producing a thick polymer film on a substrateCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2025·Application pending·0 cites
- 2854US2025364459A1Electronic die assembly comprising superconducting interconnection padsCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2025·Application pending·0 cites
- 2953US7229897B2Method for producing a stacked structureCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2001·Granted Jun 12, 2007·6 cites·29 claims
- 3053US2023110410A1Method for manufacturing components on both faces of a substrateCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2022·Application pending·0 cites
- 3152US6991944B2Surface treatment for multi-layer wafers formed from layers of materials chosen from among semiconducting materialsSOITEC SILICON ON INSULATOR·Filed 2004·Granted Jan 31, 2006·6 cites·29 claims
- 3248US2024266172A1Semiconductor structure comprising an electrically conductive bonding interface, and associated manufacturing methodCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2021·Application pending·0 cites
- 3346US10818500B2Method for wafer trimmingCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2018·Granted Oct 27, 2020·0 cites·13 claims
- 3438US7985469B2Particle network comprising particles disposed on a substrate and method for realizing such a networkCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2005·Granted Jul 26, 2011·0 cites·23 claims
- 3536US9769931B2Method for producing an electronic deviceCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2016·Granted Sep 19, 2017·0 cites·14 claims
- 3636US2006205179A1Method for making a stressed structure designed to be dissociatedFOURNEL FRANCK·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →