Inventor · disambiguated record
Francesca Iacopi
Also filed as: IACOPI FRANCESCA
11 granted patents·2 pending applications·94 citations·filing 2002–2021
88Inventor score
Top patents by PatentIndex Score
13 records- 0192US8540890B2Protective treatment for porous materialsIMEC·Filed 2012·Granted Sep 24, 2013·11 cites·22 claims
- 0284US6541842B2Metal barrier behavior by SiC:H deposition on porous materialsDOW CORNING·Filed 2002·Granted Apr 1, 2003·54 cites·11 claims
- 0378US8241983B2Method of making a hetero tunnel field effect transistorIACOPI FRANCESCA·Filed 2010·Granted Aug 14, 2012·6 cites·21 claims
- 0478US7964479B2Low-temperature formation of layers of polycrystalline semiconductor materialIMEC·Filed 2008·Granted Jun 21, 2011·6 cites·14 claims
- 0570US7632771B2UV light exposure for functionalization and hydrophobization of pure-silica zeolitesIMEC·Filed 2007·Granted Dec 15, 2009·5 cites·25 claims
- 0669US8431924B2Control of tunneling junction in a hetero tunnel field effect transistorIACOPI FRANCESCA·Filed 2012·Granted Apr 30, 2013·3 cites·20 claims
- 0764US7016028B2Method and apparatus for defect detectionIMEC INTER UNI MICRO ELECTR·Filed 2003·Granted Mar 21, 2006·9 cites·21 claims
- 0847US10910165B2Process, a structure, and a supercapacitorUNIV SYDNEY TECHNOLOGY·Filed 2016·Granted Feb 2, 2021·0 cites·7 claims
- 0945US8685877B2Doping of nanostructuresIACOPI FRANCESCA·Filed 2007·Granted Apr 1, 2014·0 cites·32 claims
- 1044US2023404458A1Graphene based electrode for electrophysiological readingsUNIV SYDNEY TECHNOLOGY·Filed 2021·Application pending·0 cites
- 1142US2006274405A1Ultraviolet curing process for low k dielectric filmsWALDFRIED CARLO·Filed 2006·Application pending·0 cites
- 1241US9771665B2Process for forming graphene layers on silicon carbideUNIV GRIFFITH·Filed 2014·Granted Sep 26, 2017·0 cites·18 claims
- 1335US11348824B2Electrical isolation structure and processUNIV SYDNEY TECHNOLOGY·Filed 2018·Granted May 31, 2022·0 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →