Inventor · disambiguated record
Frank Tim Jones
Also filed as: JONES FRANK TIM · JONES III FRANK T
6 granted patents·315 citations·filing 1982–2013
85Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0192US5895229AMicroelectronic package including a polymer encapsulated die, and method for forming sameMOTOROLA INC·Filed 1997·Granted Apr 20, 1999·128 cites·11 claims
- 0291US6093972AMicroelectronic package including a polymer encapsulated dieMOTOROLA INC·Filed 1999·Granted Jul 25, 2000·125 cites·5 claims
- 0381US4468411AMethod for providing alpha particle protection for an integrated circuit dieMOTOROLA INC·Filed 1982·Granted Aug 28, 1984·56 cites·12 claims
- 0476US9379048B2Dual-flag stacked die packageSEMICONDUCTOR COMPONENTS IND·Filed 2013·Granted Jun 28, 2016·4 cites·17 claims
- 0562US7935575B2Method of forming a semiconductor package and structure thereforSEMICONDUCTOR COMPONENTS IND·Filed 2008·Granted May 3, 2011·2 cites·10 claims
- 0647US8384206B2Semiconductor packageSEMICONDUCTOR COMPONENTS IND·Filed 2011·Granted Feb 26, 2013·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →