Inventor · disambiguated record
Frank Miceli
Also filed as: MICELI FRANK · MICELI III FRANK
40 granted patents·2 pending applications·1,005 citations·filing 1999–2008
98Inventor score
Top patents by PatentIndex Score
42 records- 0198US6368190B1Electrochemical mechanical planarization apparatus and methodAGERE SYST GUARDIAN CORP·Filed 2000·Granted Apr 9, 2002·381 cites·12 claims
- 0297US6354928B1Polishing apparatus with carrier ring and carrier head employing like polaritiesAGERE SYST GUARDIAN CORP·Filed 2000·Granted Mar 12, 2002·87 cites·28 claims
- 0385US6558238B1Apparatus and method for reclamation of used polishing slurryAGERE SYSTEMS INC·Filed 2000·Granted May 6, 2003·27 cites·7 claims
- 0481US6423149B1Apparatus and method for gradient cleaning of semiconductor wafersAGERE SYST GUARDIAN CORP·Filed 2000·Granted Jul 23, 2002·25 cites·6 claims
- 0580US6551410B2Method of cleaning a semiconductor wafer with a cleaning brush assembly having a contractible and expandable arborAGERE SYSTEMS INC·Filed 2000·Granted Apr 22, 2003·16 cites·12 claims
- 0680US6368955B1Method of polishing semiconductor structures using a two-step chemical mechanical planarization with slurry particles having different particle bulk densitiesLUCENT TECHNOLOGIES INC·Filed 1999·Granted Apr 9, 2002·57 cites·20 claims
- 0778US6234868B1Apparatus and method for conditioning a polishing padLUCENT TECHNOLOGIES INC·Filed 1999·Granted May 22, 2001·41 cites·16 claims
- 0875US6726537B1Polishing carrier headAGERE SYSTEMS INC·Filed 2000·Granted Apr 27, 2004·16 cites·4 claims
- 0974US6648734B2Polishing head for pressurized delivery of slurryAGERE SYSTEMS INC·Filed 2001·Granted Nov 18, 2003·19 cites·20 claims
- 1074US6579797B1Cleaning brush conditioning apparatusAGERE SYSTEMS INC·Filed 2000·Granted Jun 17, 2003·16 cites·9 claims
- 1174US6514123B1Semiconductor polishing pad alignment device for a polishing apparatus and method of useAGERE SYSTEMS INC·Filed 2000·Granted Feb 4, 2003·29 cites·13 claims
- 1273US6290883B1Method for making porous CMP articleLUCENT TECHNOLOGIES INC·Filed 1999·Granted Sep 18, 2001·43 cites·11 claims
- 1372US6161278AMethod for inserting wires into a telephone jack connectorLUCENT TECHNOLOGIES INC·Filed 1999·Granted Dec 19, 2000·33 cites·5 claims
- 1470US6615433B2Apparatus for detecting wetness of a semiconductor wafer cleaning brushAGERE SYSTEMS INC·Filed 2001·Granted Sep 9, 2003·8 cites·7 claims
- 1570US6309900B1Test structures for testing planarization systems and methods for using sameAGERE SYST GUARDIAN CORP·Filed 2000·Granted Oct 30, 2001·14 cites·4 claims
- 1669US6517416B1Chemical mechanical polisher including a pad conditioner and a method of manufacturing an integrated circuit using the chemical mechanical polisherAGERE SYSTEMS INC·Filed 2000·Granted Feb 11, 2003·12 cites·20 claims
- 1766US6264536B1Reducing polish platen corrosion during integrated circuit fabricationLUCENT TECHNOLOGIES INC·Filed 2000·Granted Jul 24, 2001·10 cites·23 claims
- 1863US6750145B2Method of eliminating agglomerate particles in a polishing slurryAGERE SYSTEMS INC·Filed 2001·Granted Jun 15, 2004·6 cites·4 claims
- 1963US6402599B1Slurry recirculation system for reduced slurry dryingAGERE SYST GUARDIAN CORP·Filed 2000·Granted Jun 11, 2002·10 cites·29 claims
- 2063US6354910B1Apparatus and method for in-situ measurement of polishing pad thickness lossAGERE SYST GUARDIAN CORP·Filed 2000·Granted Mar 12, 2002·11 cites·23 claims
- 2160US6508363B1Slurry containerLUCENT TECHNOLOGIES INC·Filed 2000·Granted Jan 21, 2003·5 cites·10 claims
- 2259US6288648B1Apparatus and method for determining a need to change a polishing pad conditioning wheelLUCENT TECHNOLOGIES INC·Filed 1999·Granted Sep 11, 2001·20 cites·25 claims
- 2358US6202295B1Method and tool that removes an electrical connecting block from a telecommunications boardLUCENT TECHNOLOGIES INC·Filed 1999·Granted Mar 20, 2001·19 cites·2 claims
- 2453US6287173B1Longer lifetime warm-up wafers for polishing systemsLUCENT TECHNOLOGIES INC·Filed 2000·Granted Sep 11, 2001·5 cites·21 claims
- 2551US6730603B2System and method of determining a polishing endpoint by monitoring signal intensityAGERE SYSTEMS INC·Filed 2001·Granted May 4, 2004·3 cites·14 claims
- 2650US6728364B2Analog phone bank connectorAGERE SYSTEMS INC·Filed 2001·Granted Apr 27, 2004·1 cites·9 claims
- 2748US7527544B2System of using offset gage for CMP polishing pad alignment and adjustmentAGERE SYSTEMS INC·Filed 2008·Granted May 5, 2009·0 cites·10 claims
- 2848US6462305B1Method of manufacturing a polishing pad using a beamAGERE SYSTEMS INC·Filed 2001·Granted Oct 8, 2002·2 cites·23 claims
- 2946US6293847B1Apparatus for chemical mechanical polishing endpoint detection using a hydrogen sensorAGERE SYST GUARDIAN CORP·Filed 1999·Granted Sep 25, 2001·11 cites·18 claims
- 3045US6537135B1Curvilinear chemical mechanical planarization device and methodAGERE SYSTEMS INC·Filed 1999·Granted Mar 25, 2003·10 cites·2 claims
- 3145US6518987B1Mouse and mouse template for a motion impaired userAGERE SYSTEMS INC·Filed 1999·Granted Feb 11, 2003·17 cites·18 claims
- 3245US6355184B1Method of eliminating agglomerate particles in a polishing slurryAGERE SYST GUARDIAN CORP·Filed 1999·Granted Mar 12, 2002·8 cites·4 claims
- 3344US6369799B1Computer pointer device for handicapped personsLUCENT TECHNOLOGIES INC·Filed 1999·Granted Apr 9, 2002·16 cites·14 claims
- 3443US7338569B2Method and system of using offset gage for CMP polishing pad alignment and adjustmentAGERE SYSTEMS INC·Filed 2004·Granted Mar 4, 2008·2 cites·12 claims
- 3543US6183652B1Method for removing microorganism contamination from a polishing slurryLUCENT TECHNOLOGIES INC·Filed 1999·Granted Feb 6, 2001·10 cites·19 claims
- 3637US6093086APolishing head release mechanismLUCENT TECHNOLOGIES INC·Filed 1999·Granted Jul 25, 2000·6 cites·23 claims
- 3736US6254454B1Reference thickness endpoint techniques for polishing operationsAGERE SYST GUARDIAN CORP·Filed 1999·Granted Jul 3, 2001·6 cites·19 claims
- 3836US2002151260A1Carrier head for a chemical mechanical polishing apparatusFiled 2001·Application pending·0 cites
- 3935US2002090889A1Apparatus and method of determining an endpoint during a chemical-mechanical polishing processFiled 2001·Application pending·0 cites
- 4030US6206770B1Wafer carrier head for prevention of unintentional semiconductor wafer rotationLUCENT TECHNOLOGIES INC·Filed 1999·Granted Mar 27, 2001·0 cites·9 claims
- 4129US6373945B1Terminal block extension for greater wire packing efficiencyAGERE SYST GUARDIAN CORP·Filed 1999·Granted Apr 16, 2002·0 cites·17 claims
- 4229US6281128B1Wafer carrier modification for reduced extraction forceAGERE SYST GUARDIAN CORP·Filed 1999·Granted Aug 28, 2001·3 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →