Inventor · disambiguated record
Frederik Otto
Also filed as: OTTO FREDERIK
3 granted patents·4 pending applications·4 citations·filing 2015–2025
53Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0176US9659793B2Method for producing a material-bonding connection between a semiconductor chip and a metal layerINFINEON TECHNOLOGIES AG·Filed 2015·Granted May 23, 2017·4 cites·16 claims
- 0256US2025062169A1Application of a protective atomic layer deposition (ald) or plasma-enhanced chemical vapor deposition (pecvd) layer on a semiconductor die connected to a substrate via a sintered layerINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 0355US2024162129A1Substrate arrangement and methods for producing a substrate arrangementINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 0453US11581194B2Sintering method using a sacrificial layer on the backside metallization of a semiconductor dieINFINEON TECHNOLOGIES AG·Filed 2021·Granted Feb 14, 2023·0 cites·11 claims
- 0546US11329021B2Method for fabricating a semiconductor device comprising a paste layer and semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2019·Granted May 10, 2022·0 cites·16 claims
- 0646US2025253280A1Sinterable electrical contact on a semiconductor substrateINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 0742US2025259923A1Power semiconductor module arrangement and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →