Inventor · disambiguated record
Francis J. Pakulski
Also filed as: PAKULSKI FRANCIS J
3 granted patents·253 citations·filing 1984–1991
78Inventor score
Files withIBM3
Top patents by PatentIndex Score
3 records- 0190US5086018AMethod of making a planarized thin film covered wire bonded semiconductor packageIBM·Filed 1991·Granted Feb 4, 1992·155 cites·11 claims
- 0277US5151559APlanarized thin film surface covered wire bonded semiconductor packageIBM·Filed 1991·Granted Sep 29, 1992·61 cites·9 claims
- 0367US4633440AMulti-port memory chip in a hierarchical memoryIBM·Filed 1984·Granted Dec 30, 1986·37 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →