Inventor · disambiguated record
Francis Poh
Also filed as: POH FRANCIS · POH FRANCIS KOON SEONG
2 granted patents·1 pending application·40 citations·filing 2003–2006
63Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0191US7323769B2High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing packageUNITED TEST & ASSEMBLY CT LTD·Filed 2006·Granted Jan 29, 2008·28 cites·20 claims
- 0252US7109570B2Integrated circuit package with leadframe enhancement and method of manufacturing the sameUNITED TEST AND ASSEMBLY TEST·Filed 2004·Granted Sep 19, 2006·12 cites·6 claims
- 0333US2004124508A1High performance chip scale leadframe package and method of manufacturing the packageUNITED TEST AND ASSEMBLY TEST·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →