Inventor · disambiguated record
Frank J. Polese
Also filed as: POLESE FRANK J
10 granted patents·7 pending applications·547 citations·filing 1993–2025
92Inventor score
Top patents by PatentIndex Score
17 records- 0191US5972737AHeat-dissipating package for microcircuit devices and process for manufacturePOLESE FRANK J·Filed 1999·Granted Oct 26, 1999·165 cites·4 claims
- 0291US5886407AHeat-dissipating package for microcircuit devicesPOLESE FRANK J·Filed 1996·Granted Mar 23, 1999·168 cites·10 claims
- 0385US6462413B1LDMOS transistor heatsink package assembly and manufacturing methodPOLESE COMPANY INC·Filed 2000·Granted Oct 8, 2002·69 cites·9 claims
- 0481US9340462B2Transient liquid phase, pressureless joining of aluminum nitride componentsHARRIS JONATHAN H·Filed 2013·Granted May 17, 2016·13 cites·11 claims
- 0573US6238454B1Isotropic carbon/copper compositesPOLESE FRANK J·Filed 1997·Granted May 29, 2001·50 cites·22 claims
- 0666US12300578B2Aluminum nitride multilayer power module interposer and methodTRIPENT POWER LLC·Filed 2020·Granted May 13, 2025·1 cites·20 claims
- 0764US6250127B1Heat-dissipating aluminum silicon carbide composite manufacturing methodPOLESE COMPANY INC·Filed 1999·Granted Jun 26, 2001·41 cites·17 claims
- 0858US2025273539A1Aluminum nitride multilayer power module interposer and methodTRIPENT POWER LLC·Filed 2025·Application pending·0 cites
- 0943US6096111AExothermically sintered homogeneous composite and fabrication methodPOLESE FRANK J·Filed 1998·Granted Aug 1, 2000·16 cites·20 claims
- 1043US2016150594A1Thermocompression bonding apparatus and methodNOOTENS STEPHEN P·Filed 2014·Application pending·0 cites
- 1142US2015016083A1Thermocompression bonding apparatus and methodNOOTENS STEPHEN P·Filed 2014·Application pending·0 cites
- 1240US5413751AMethod for making heat-dissipating elements for micro-electronic devicesPOLESE FRANK J·Filed 1993·Granted May 9, 1995·16 cites·15 claims
- 1338US5878322AHeat-dissipating substrate for micro-electronic devices and fabrication methodFiled 1997·Granted Mar 2, 1999·8 cites·18 claims
- 1437US2004052468A1Alignable electro-optical microelectronic package and methodFiled 2003·Application pending·0 cites
- 1532US2004156736A1Homogeneous shaped charge liner and fabrication methodFiled 2003·Application pending·0 cites
- 1630US2003178718A1Hermetically enhanced plastic package for microelectronics and manufacturing processFiled 2002·Application pending·0 cites
- 1722US2002006526A1Aluminum silicon carbide and copper clad material and manufacturing processFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →