Inventor · disambiguated record
Fulvio Vittorio Fontana
Also filed as: FONTANA FULVIO · FONTANA FULVIO VITTORIO
37 granted patents·5 pending applications·118 citations·filing 2000–2024
96Inventor score
Top patents by PatentIndex Score
42 records- 0196US7898043B2Package, in particular for MEMS devices and method of making sameST MICROELECTRONICS SRL·Filed 2008·Granted Mar 1, 2011·31 cites·34 claims
- 0290US10639661B2Device of a wearable type for dispensing a fluid, and corresponding dispensing methodST MICROELECTRONICS SRL·Filed 2015·Granted May 5, 2020·10 cites·23 claims
- 0390US9824956B2Surface-mount semiconductor device having exposed solder materialST MICROELECTRONICS SRL·Filed 2015·Granted Nov 21, 2017·6 cites·20 claims
- 0489US10593612B2SMDs integration on QFN by 3D stacked solutionST MICROELECTRONICS SRL·Filed 2018·Granted Mar 17, 2020·5 cites·20 claims
- 0588US9642244B2Micro-electro-mechanical systems (MEMS) and corresponding manufacturing processST MICROELECTRONICS SRL·Filed 2013·Granted May 2, 2017·7 cites·14 claims
- 0683US9011776B2Packaged device exposed to environmental air and liquids and manufacturing method thereofST MICROELECTRONICS SRL·Filed 2013·Granted Apr 21, 2015·6 cites·22 claims
- 0781US12354932B2SMDs integration on QFN by 3D stacked solutionST MICROELECTRONICS SRL·Filed 2023·Granted Jul 8, 2025·0 cites·20 claims
- 0881US2025070000A1Lead frame for a package for a semiconductor device, semiconductor device and process for manufacturing a semiconductor deviceST MICROELECTRONICS SRL·Filed 2024·Application pending·0 cites
- 0979US9841341B2Package for semiconductor devices sensitive to mechanical and thermo-mechanical stresses, such as MEMS pressure sensorsST MICROELECTRONICS SRL·Filed 2015·Granted Dec 12, 2017·3 cites·23 claims
- 1079US9322839B2Magnetic inertial sensor and method for operating the sameST MICROELECTRONICS SRL·Filed 2013·Granted Apr 26, 2016·4 cites·27 claims
- 1178US11152289B2Semiconductor device and corresponding methodST MICROELECTRONICS SRL·Filed 2019·Granted Oct 19, 2021·2 cites·20 claims
- 1278US10211140B2Electronic device with die being sunk in substateST MICROELECTRONICS SRL·Filed 2017·Granted Feb 19, 2019·2 cites·20 claims
- 1377US12142552B2Lead frame for a package for a semiconductor device, semiconductor device and process for manufacturing a semiconductor deviceST MICROELECTRONICS SRL·Filed 2022·Granted Nov 12, 2024·0 cites·15 claims
- 1477US7998774B2Package, in particular for MEMS devices and method of making sameST MICROELECTRONICS SRL·Filed 2010·Granted Aug 16, 2011·2 cites·14 claims
- 1575US7007171B1Method and apparatus for improved fold retention on a security enclosureIBM·Filed 2000·Granted Feb 28, 2006·32 cites·29 claims
- 1675US2024347495A1Method of manufacturing semiconductor products, semiconductor product, device and testing methodST MICROELECTRONICS SRL·Filed 2024·Application pending·0 cites
- 1773US9460841B2Integrated inductor device with high inductance in a radiofrequency identification systemFONTANA FULVIO VITTORIO·Filed 2012·Granted Oct 4, 2016·3 cites·16 claims
- 1872US9698027B2Method of fabricating integrated circuits having a recessed molding package and corresponding packageST MICROELECTRONICS SRL·Filed 2016·Granted Jul 4, 2017·2 cites·22 claims
- 1970US11842948B2SMDs integration on QFN by 3D stacked solutionST MICROELECTRONICS SRL·Filed 2021·Granted Dec 12, 2023·0 cites·20 claims
- 2069US11626355B2Semiconductor device and corresponding methodST MICROELECTRONICS SRL·Filed 2021·Granted Apr 11, 2023·0 cites·20 claims
- 2169US11515240B2Lead frame for a package for a semiconductor device, semiconductor device and process for manufacturing a semiconductor deviceST MICROELECTRONICS SRL·Filed 2020·Granted Nov 29, 2022·0 cites·26 claims
- 2268US11004775B2SMDS integration on QFN by 3D stacked solutionST MICROELECTRONICS SRL·Filed 2020·Granted May 11, 2021·0 cites·20 claims
- 2368US9137895B2Micro-electro-mechanical systems (MEMS) and corresponding manufacturing processFONTANA FULVIO VITTORIO·Filed 2009·Granted Sep 15, 2015·3 cites·23 claims
- 2464US12021052B2Method of manufacturing semiconductor products, semiconductor product, device and testing methodST MICROELECTRONICS SRL·Filed 2021·Granted Jun 25, 2024·0 cites·14 claims
- 2563US2025105024A1Method of manufacturing semiconductor devices and corresponding semiconductor deviceST MICROELECTRONICS SRL·Filed 2024·Application pending·0 cites
- 2660US10593614B2Integrated capacitors on lead frame in semiconductor devicesST MICROELECTRONICS SRL·Filed 2019·Granted Mar 17, 2020·0 cites·17 claims
- 2759US10643940B2Electronic device with die being sunk in substrateST MICROELECTRONICS SRL·Filed 2019·Granted May 5, 2020·0 cites·16 claims
- 2858US12211772B2Method of manufacturing semiconductor devices and corresponding semiconductor deviceST MICROELECTRONICS SRL·Filed 2022·Granted Jan 28, 2025·0 cites·28 claims
- 2958US2023360927A1Method of manufacturing semiconductor devices, corresponding device and systemST MICROELECTRONICS SRL·Filed 2023·Application pending·0 cites
- 3056US10026679B2Process for manufacturing a package for a surface-mount semiconductor device and semiconductor deviceST MICROELECTRONICS SRL·Filed 2017·Granted Jul 17, 2018·0 cites·23 claims
- 3155US12165880B2Method of manufacturing semiconductor devices and corresponding semiconductor deviceST MICROELECTRONICS SRL·Filed 2021·Granted Dec 10, 2024·0 cites·16 claims
- 3255US10211129B2Process for manufacturing a surface-mount semiconductor device having exposed solder materialST MICROELECTRONICS SRL·Filed 2017·Granted Feb 19, 2019·0 cites·19 claims
- 3353US9640468B2Process for manufacturing a package for a surface-mount semiconductor device and semiconductor deviceST MICROELECTRONICS SRL·Filed 2015·Granted May 2, 2017·0 cites·21 claims
- 3452US10283441B2Method of integrating capacitors on lead frame in semiconductor devicesST MICROELECTRONICS SRL·Filed 2016·Granted May 7, 2019·0 cites·19 claims
- 3552US9618532B2Magnetic inertial sensor and method for operating the sameST MICROELECTRONICS SRL·Filed 2016·Granted Apr 11, 2017·0 cites·20 claims
- 3651US10128057B2Supercapacitor with movable separator and method of operating a supercapacitorST MICROELECTRONICS SRL·Filed 2016·Granted Nov 13, 2018·0 cites·20 claims
- 3751US9704794B2Electronic device with die being sunk in substrateST MICROELECTRONICS SRL·Filed 2015·Granted Jul 11, 2017·0 cites·22 claims
- 3849US9060227B2Shielded encapsulating structure and manufacturing method thereofST MICROELECTRONICS SRL·Filed 2012·Granted Jun 16, 2015·0 cites·22 claims
- 3948US12230511B2Method of manufacturing semiconductor devices and corresponding deviceST MICROELECTRONICS SRL·Filed 2021·Granted Feb 18, 2025·0 cites·15 claims
- 4047US9972562B2Semiconductor device and corresponding methodST MICROELECTRONICS SRL·Filed 2017·Granted May 15, 2018·0 cites·18 claims
- 4147US2014371631A1Mobile device for an electronic stethoscope including an electronic microphone and a unit for detecting the position of the mobile deviceST MICROELECTRONICS SRL·Filed 2014·Application pending·0 cites
- 4245US9428380B2Shielded encapsulating structure and manufacturing method thereofST MICROELECTRONICS SRL·Filed 2015·Granted Aug 30, 2016·0 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →