Inventor · disambiguated record
Futoshi Fukaya
Also filed as: FUKAYA FUTOSHI
12 granted patents·371 citations·filing 1997–2008
93Inventor score
Top patents by PatentIndex Score
12 records- 0192US6229320B1IC socket, a test method using the same and an IC socket mounting mechanismFUJITSU LTD·Filed 1997·Granted May 8, 2001·82 cites·22 claims
- 0289US6535002B2IC socket, a test method using the same and an IC socket mounting mechanismFUJITSU LTD·Filed 2001·Granted Mar 18, 2003·36 cites·8 claims
- 0384US6466046B1Contactor for semiconductor devices, a testing apparatus using such contactor, a testing method using such contactor, and a method of cleaning such contactorFUJITSU LTD·Filed 1999·Granted Oct 15, 2002·56 cites·20 claims
- 0483US5986459ASemiconductor device testing carrier and method of fixing semiconductor device to testing carrierFUJITSU LTD·Filed 1997·Granted Nov 16, 1999·71 cites·13 claims
- 0580US6249135B1Method and apparatus for passive optical characterization of semiconductor substrates subjected to high energy (MEV) ion implantation using high-injection surface photovoltageFUJITSU LTD·Filed 1999·Granted Jun 19, 2001·34 cites·3 claims
- 0678US6555764B1Integrated circuit contactor, and method and apparatus for production of integrated circuit contactorFUJITSU LTD·Filed 1999·Granted Apr 29, 2003·36 cites·3 claims
- 0774US6781395B2Contactor for semiconductor devices, a testing apparatus using such contactor, a testing method using such contactor, and a method of cleaning such contactorFUJITSU LTD·Filed 2003·Granted Aug 24, 2004·13 cites·1 claims
- 0870US6603325B2Contactor for semiconductor devices, a testing apparatus using such contactor, a testing method using such contactor, and a method of cleaning such contactorFUJITSU LTD·Filed 2002·Granted Aug 5, 2003·10 cites·5 claims
- 0967US6046598ATest board and a test method using the same providing improved electrical connectionFUJITSU LTD·Filed 1997·Granted Apr 4, 2000·27 cites·33 claims
- 1064US7646089B2Semiconductor package, method for manufacturing a semiconductor package, an electronic device, method for manufacturing an electronic deviceFUJITSU LTD·Filed 2008·Granted Jan 12, 2010·4 cites·10 claims
- 1148US7682140B2Mold for resin molding, resin molding apparatus, and semiconductor device manufacture methodFUJITSU MICROELECTRONICS LTD·Filed 2007·Granted Mar 23, 2010·0 cites·5 claims
- 1243US7174629B2Integrated circuit contactor, and method and apparatus for production of integrated circuit contactorFUJITSU LTD·Filed 2003·Granted Feb 13, 2007·2 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →