Inventor · disambiguated record
Fu-Ming Huang
Also filed as: HUANG FU · HUANG FU-MING
23 granted patents·7 pending applications·76 citations·filing 1996–2024
93Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD25HUANG FU-MING1TAIWAN SEMICONDUCTOR MFG1TSAI CHI-MING1ZHEJIANG CHANGXING CREFLUX MEMBRANE TECH CO LTD1
Top patents by PatentIndex Score
30 records- 0194US9630295B2Mechanisms for removing debris from polishing padTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Apr 25, 2017·25 cites·20 claims
- 0289US9460997B2Interconnect structure for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 4, 2016·7 cites·20 claims
- 0388US10269555B2Post-CMP cleaning and apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 23, 2019·4 cites·20 claims
- 0486US11772228B2Chemical mechanical polishing apparatus including a multi-zone platenTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 3, 2023·2 cites·20 claims
- 0586US11679469B2Chemical mechanical planarization toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 20, 2023·2 cites·18 claims
- 0684US9962805B2Chemical mechanical polishing apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 8, 2018·2 cites·20 claims
- 0783US12172263B2Chemical mechanical planarization toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·20 claims
- 0883US12170195B2Post-CMP cleaning and apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 17, 2024·0 cites·20 claims
- 0978US11728157B2Post-CMP cleaning and apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 15, 2023·0 cites·20 claims
- 1076US12002684B2Methods for chemical mechanical polishing and forming interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 4, 2024·0 cites·20 claims
- 1176US2024290629A1Methods for chemical mechanical polishing and forming interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1274US2024363404A1Ion implant process for defect elimination in metal layer planarizationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1371US5756024AMethod of manufacturing a biodegradable containerFiled 1996·Granted May 26, 1998·32 cites·13 claims
- 1469US2023364733A1Chemical Mechanical Polishing Apparatus Including a Multi-Zone PlatenTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1567US11508585B2Methods for chemical mechanical polishing and forming interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 22, 2022·0 cites·20 claims
- 1666US2022359277A1Ion implant process for defect elimination in metal layer planarizationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1765US11322345B2Post-CMP cleaning and apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 3, 2022·0 cites·20 claims
- 1865US9252060B2Reduction of OCD measurement noise by way of metal via slotsTSAI CHI-MING·Filed 2012·Granted Feb 2, 2016·2 cites·20 claims
- 1961US9723915B2Brush cleaning methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 8, 2017·0 cites·20 claims
- 2058US10062645B2Interconnect structure for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 28, 2018·0 cites·20 claims
- 2157US11658065B2Chemical mechanical polishing slurry composition, method for chemical mechanical polishing and method for forming connecting structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 23, 2023·0 cites·20 claims
- 2257US9679848B2Interconnect structure for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 13, 2017·0 cites·20 claims
- 2357US2025038008A1Methods for chemical mechanical polishing and methods for forming an interconnect structure of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2456US12297375B2Slurry composition and method for polishing and integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 13, 2025·0 cites·20 claims
- 2555US11450565B2Ion implant process for defect elimination in metal layer planarizationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 20, 2022·0 cites·20 claims
- 2654US9119464B2Brush cleaning systemHUANG FU-MING·Filed 2012·Granted Sep 1, 2015·0 cites·20 claims
- 2749US9305880B2Interconnects for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Apr 5, 2016·0 cites·19 claims
- 2845US9370854B2Method of fabricating a semiconductor device, and chemical mechanical polish toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jun 21, 2016·0 cites·15 claims
- 2942US2015087208A1Apparatus and method for manufacturing a semiconductor waferTAIWAN SEMICONDUCTOR MFG·Filed 2013·Application pending·0 cites
- 3037US2021354089A1Preparation method of high-performance mabr hollow fiber composite membraneZHEJIANG CHANGXING CREFLUX MEMBRANE TECH CO LTD·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →