Inventor · disambiguated record
Fumiya Isaka
Also filed as: ISAKA FUMIYA
0 granted patents·6 pending applications·0 citations·filing 2011–2012
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0139US2013001632A1Light-emitting element mounting substrate, led package and method of manufacturing the led packageHITACHI CABLE·Filed 2012·Application pending·0 cites
- 0236US2013001633A1Light-emitting element mounting substrate and led packageHITACHI CABLE·Filed 2012·Application pending·0 cites
- 0335US2012002420A1LED module, LED package, and wiring substrate and method of making sameIMAI NOBORU·Filed 2011·Application pending·0 cites
- 0435US2013087368A1Heating element mounting substrate, method of manufacturing the same and semiconductor packageHITACHI CABLE·Filed 2012·Application pending·0 cites
- 0535US2013001618A1Light-emitting element mounting substrate and led packageHITACHI CABLE·Filed 2012·Application pending·0 cites
- 0633US2013087367A1Heating element mounting substrate, method of manufacturing the same and semiconductor packageHITACHI CABLE·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →