Inventor · disambiguated record
Fu-Chiang Kuo
Also filed as: KUO Fu-Chiang
17 granted patents·21 pending applications·13 citations·filing 2015–2025
89Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD38
Top patents by PatentIndex Score
38 records- 0194US11855129B2Capacitance structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·3 cites·20 claims
- 0292US11817510B2Semiconductor trench capacitor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 14, 2023·2 cites·20 claims
- 0391US12119414B2Semiconductor trench capacitor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 15, 2024·1 cites·20 claims
- 0487US10115679B1Trench structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 30, 2018·4 cites·20 claims
- 0586US10804206B2Deep trench protectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 13, 2020·3 cites·17 claims
- 0681US2025324627A1Capacitance structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0780US12113099B2Deep trench capacitor including stress-relief voids and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
- 0880US2025359081A1Structure and Method for Deep Trench Capacitor with Reduced DeformationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0979US12408357B2Capacitance structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 2, 2025·0 cites·20 claims
- 1078US2025031393A1Deep trench capacitor including stress-relief voids and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1177US2025349716A1Contact arrangements for deep trench capacitorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1277US2024372014A1Semiconductor trench capacitor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1376US2025336848A1Manufacturing method of semiconductor structure and package structure having the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1475US12444688B2Deep trench protectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 14, 2025·0 cites·20 claims
- 1572US2024387610A1Semiconductor arrangement and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1672US2025357311A1Semiconductor device including dummy deep trench capacitors and a method of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1771US12015050B2Deep trench capacitor including stress-relief voids and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 18, 2024·0 cites·20 claims
- 1871US2025301671A1Deep trench capacitor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1970US11373952B2Deep trench protectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 28, 2022·0 cites·20 claims
- 2070US2025275158A1Deformation-resistant deep trench capacitor structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2170US2024047552A1Structure and Method for Deep Trench Capacitor with Reduced DeformationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2270US2025275160A1Deep trench capacitor array with reduced warpageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2366US12431444B2Package structure having trench capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 30, 2025·0 cites·20 claims
- 2466US2023369213A1Contact arrangements for deep trench capacitorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2565US12424538B2Semiconductor device including dummy deep trench capacitors and a method of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 23, 2025·0 cites·20 claims
- 2665US12356636B2Deep trench capacitor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 8, 2025·0 cites·20 claims
- 2763US12294033B2Deep trench capacitor array with reduced warpageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 6, 2025·0 cites·20 claims
- 2863US2022310778A1Semiconductor arrangement and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
- 2961US12328881B2Deformation-resistant deep trench capacitor structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 10, 2025·0 cites·20 claims
- 3059US10424549B2Trench structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 24, 2019·0 cites·20 claims
- 3155US2024079353A1Passive Semiconductor DeviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3255US2024412982A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3354US2024105707A1Semiconductor Structures And Methods Of Forming The SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3454US2023352404A1Interconnect structure patternTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3551US2024321944A1Structure and method for deep trench capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3650US2024153897A1Semiconductor device with advanced pad structure and method for forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3748US2024128261A1Passive Device Dies With Measurement StructuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3840US9659874B2Method of forming deep trench and deep trench isolation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 23, 2017·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →