Inventor · disambiguated record
Fujio Kuwako
Also filed as: KUWAKO FUJIO
12 granted patents·219 citations·filing 1999–2018
90Inventor score
Top patents by PatentIndex Score
12 records- 0191US6693793B2Double-sided copper clad laminate for capacitor layer formation and its manufacturing methodMITSUI MINING & SMELTING CO·Filed 2001·Granted Feb 17, 2004·50 cites·38 claims
- 0291US6240636B1Method for producing vias in the manufacture of printed circuit boardsMITSUI MINING & SMELTING CO·Filed 1999·Granted Jun 5, 2001·91 cites·6 claims
- 0375US6905757B2Dielectric filler containing resin for use in formation of built-in capacitor layer of printed wiring board and double-sided copper clad laminate with dielectric layer formed using the same dielectric filler containing resin, and production method of double-sided copper clad laminateMITSUI MINING & SMELTING CO·Filed 2003·Granted Jun 14, 2005·15 cites·9 claims
- 0473US6107003AMethod for producing multi-layer printed wiring boards having blind viasMITSUI MINING & SMELTING CO·Filed 1999·Granted Aug 22, 2000·36 cites·9 claims
- 0567US11166383B2Resin-clad copper foil, copper-clad laminated plate, and printed wiring boardMITSUI MINING & SMELTING CO LTD·Filed 2016·Granted Nov 2, 2021·1 cites·10 claims
- 0667US6884944B1Multi-layer printed wiring boards having blind viasMITSUI MINING & SMELTING CO·Filed 2000·Granted Apr 26, 2005·14 cites·10 claims
- 0759US6551433B2Method for producing copper-clad laminateMITSUI MINING & SMELTING CO·Filed 2001·Granted Apr 22, 2003·9 cites·3 claims
- 0858US10524360B2Copper clad laminate for forming of embedded capacitor layer, multilayered printed wiring board, and manufacturing method of multilayered printed wiring boardMITSUI MINING & SMELTING CO·Filed 2018·Granted Dec 31, 2019·0 cites·11 claims
- 0958US8866018B2Passive electrical devices and methods of fabricating passive electrical devicesPRAMANIK PRANABES K·Filed 2009·Granted Oct 21, 2014·3 cites·16 claims
- 1051US9924597B2Copper clad laminate for forming of embedded capacitor layer, multilayered printed wiring board, and manufacturing method of multilayered printed wiring boardMITSUI MINING & SMELTING CO·Filed 2015·Granted Mar 20, 2018·0 cites·4 claims
- 1146US10863621B2Metal foil with releasing resin layer, and printed wiring boardMITSUI MINING & SMELTING CO·Filed 2015·Granted Dec 8, 2020·0 cites·14 claims
- 1234US10244640B2Copper clad laminate provided with protective layer and multilayered printed wiring boardMITSUI MINING & SMELTING CO·Filed 2015·Granted Mar 26, 2019·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →