Inventor · disambiguated record

Fukang Lee

Also filed as: LEE FUKANG

0 granted patents·2 pending applications·0 citations·filing 2024–2024

Technology areasH10W

Files withTEXAS INSTRUMENTS INC2

Top patents by PatentIndex Score

2 records

0161US2025336872A1Microelectronic device package with embedded semiconductor dies integrated with integral passive componentsTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
0249US2025279336A1Microelectronic device package with multilayer package substrateTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →