Inventor · disambiguated record
Fu-Jen Li
Also filed as: LI FU-JEN
24 granted patents·3 pending applications·79 citations·filing 2011–2025
94Inventor score
Technology areasH10W
Top patents by PatentIndex Score
27 records- 0195US8624392B2Electrical connection for chip scale packagingYEW MING-CHIH·Filed 2011·Granted Jan 7, 2014·34 cites·20 claims
- 0291US10685920B2Semiconductor device package with warpage control structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 16, 2020·5 cites·20 claims
- 0391US8901732B2Semiconductor device package and methodTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 2, 2014·12 cites·20 claims
- 0489US9831190B2Semiconductor device package with warpage control structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 28, 2017·7 cites·20 claims
- 0588US9780076B2Package-on-package structure with through molding viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 3, 2017·4 cites·20 claims
- 0687US9237647B2Package-on-package structure with through molding viaTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 12, 2016·6 cites·20 claims
- 0782US11600562B2Semiconductor packages and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 7, 2023·1 cites·20 claims
- 0879US12347817B2Semiconductor device package having warpage controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 1, 2025·0 cites·20 claims
- 0978US12261125B2Method for forming chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 25, 2025·0 cites·20 claims
- 1078US11764169B2Semiconductor device package with warpage control structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 19, 2023·0 cites·20 claims
- 1178US2024379640A1Method of forming a semiconductor device package with warpage controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1277US12107038B2Semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 1, 2024·0 cites·20 claims
- 1377US9548281B2Electrical connection for chip scale packagingYEW MING-CHIH·Filed 2011·Granted Jan 17, 2017·5 cites·20 claims
- 1477US2024371745A1Semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1575US9543284B23D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 10, 2017·2 cites·20 claims
- 1675US2025210536A1Chip package structure with conductive pillarTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1774US11088109B2Packages with multi-thermal interface materials and methods of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·2 cites·20 claims
- 1872US11329006B2Semiconductor device package with warpage control structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 10, 2022·0 cites·20 claims
- 1970US11804445B2Method for forming chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 31, 2023·0 cites·20 claims
- 2069US11978729B2Semiconductor device package having warpage control and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 7, 2024·0 cites·20 claims
- 2163US9252076B23D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 2, 2016·1 cites·19 claims
- 2259US11121093B2Methods for selectively forming identification mark on semiconductor waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 14, 2021·0 cites·20 claims
- 2358US10008480B2Package-on-package structure with through molding viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 26, 2018·0 cites·20 claims
- 2456US9087882B2Electrical connection for chip scale packagingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 21, 2015·0 cites·20 claims
- 2555US9502387B2Package-on-package structure with through molding viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 22, 2016·0 cites·20 claims
- 2652US10643951B2Mini identification mark in die-less region of semiconductor waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 5, 2020·0 cites·20 claims
- 2751US9515038B2Electrical connection for chip scale packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 6, 2016·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →