Inventor · disambiguated record
Fushou Li
Also filed as: LI FUSHOU
0 granted patents·3 pending applications·0 citations·filing 2006–2006
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0141US2008258273A1Package Structure With Flat Bumps For Electronic Device and Method of Manufacture the SameJIANGSU CHANGJIANG ELECTRONICS·Filed 2006·Application pending·0 cites
- 0241US2008315412A1Package Structure with Flat Bumps for Integrate Circuit or Discrete Device and Method of Manufacture the SameJIANGSU CHANGJIANG ELECTRONICS·Filed 2006·Application pending·0 cites
- 0340US2008285251A1Packaging Substrate with Flat Bumps for Electronic Devices and Method of Manufacturing the SameJIANGSU CHANGIANG ELECTRONICS·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →