Inventor · disambiguated record
Fui Yee Lim
Also filed as: LIM FUI YEE
6 granted patents·44 citations·filing 2012–2023
76Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0194US11581241B2Circuit modules with front-side interposer terminals and through-module thermal dissipation structuresNXP USA INC·Filed 2020·Granted Feb 14, 2023·3 cites·19 claims
- 0291US9209081B2Semiconductor grid array packageLIM FUI YEE·Filed 2013·Granted Dec 8, 2015·37 cites·16 claims
- 0377US8941194B1Pressure sensor device having bump chip carrier (BCC)LO WAI YEW·Filed 2013·Granted Jan 27, 2015·4 cites·10 claims
- 0458US12446158B2Circuit modules with encapsulant-embedded leadframe terminals, and methods of fabricating such circuit modulesNXP USA INC·Filed 2023·Granted Oct 14, 2025·0 cites·16 claims
- 0557US12482719B2Low-stress thermal interfaceNXP USA INC·Filed 2022·Granted Nov 25, 2025·0 cites·26 claims
- 0647US8546169B1Pressure sensor device and method of assembling sameLO WAI YEW·Filed 2012·Granted Oct 1, 2013·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →