Inventor · disambiguated record
Fumiya Maeda
Also filed as: MAEDA FUMIYA
3 granted patents·10 pending applications·0 citations·filing 2022–2023
43Inventor score
Files withSEIKO EPSON CORP13
Top patents by PatentIndex Score
13 records- 0178US11878345B2Thixomolding materialSEIKO EPSON CORP·Filed 2022·Granted Jan 23, 2024·0 cites·3 claims
- 0267US12479021B2Thixomolding material and method of manufacturing thixomolding materialSEIKO EPSON CORP·Filed 2022·Granted Nov 25, 2025·0 cites·6 claims
- 0367US2024217813A1Thixotropically Molded Product, Thixotropic Molding Material, And Method Of Producing Thixotropic Molding MaterialSEIKO EPSON CORP·Filed 2023·Application pending·0 cites
- 0464US2024218484A1Thixotropic Molding Material, Method Of Producing Thixotropic Molding Material, And Thixotropically Molded ProductSEIKO EPSON CORP·Filed 2023·Application pending·0 cites
- 0564US2024166507A1Hydrogen-oxidizing bacteria culturing method and hydrogen-oxidizing bacteria culturing apparatusSEIKO EPSON CORP·Filed 2023·Application pending·0 cites
- 0664US2024218521A1Molded Product, Thixotropic Molding Material, And Method Of Producing Thixotropic Molding MaterialSEIKO EPSON CORP·Filed 2023·Application pending·0 cites
- 0762US2024209312A1Hydrogen-Oxidizing Bacteria Culturing Method And Hydrogen-Oxidizing Bacteria Culturing ApparatusSEIKO EPSON CORP·Filed 2023·Application pending·0 cites
- 0862US2024216988A1Thixotropically Molded Product, Thixotropic Molding Material, And Method Of Producing Thixotropic Molding MaterialSEIKO EPSON CORP·Filed 2023·Application pending·0 cites
- 0962US2024218522A1Thixotropically Molded Product, Thixotropic Molding Material, And Method Of Producing Thixotropic Molding MaterialSEIKO EPSON CORP·Filed 2023·Application pending·0 cites
- 1056US2024218230A1Thixotropically Molded Product And Thixotropic Molding MaterialSEIKO EPSON CORP·Filed 2023·Application pending·0 cites
- 1156US2022316035A1Thixomolding material, method for manufacturing thixomolding material, and thixomolded articleSEIKO EPSON CORP·Filed 2022·Application pending·0 cites
- 1255US12311437B2Thixomolding materialSEIKO EPSON CORP·Filed 2022·Granted May 27, 2025·0 cites·3 claims
- 1349US2022316070A1Thixomolding material, method for manufacturing thixomolding material, and thixomolded articleSEIKO EPSON CORP·Filed 2022·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Fumiya Maeda files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →